Doping telluride for tuning the crystal structure and thermoelectric performance of copper selenide-based materials

IF 2.5 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Applied Physics A Pub Date : 2024-09-13 DOI:10.1007/s00339-024-07851-7
Lisha Xue, Zhan Gao, Yuan Wang, Qianhui Mao, Zhanheng Yan
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Abstract

The prototype phonon-liquid electron-crystal β-Cu2Se has been recognized as one of the top-performing thermoelectric materials due to its ultralow lattice thermal conductivity (κ ). This paper reports the synthesis of Telluride-doped Bi0.001Cu2Se through the combination of ball milling and spark plasma sintering. The thermoelectric properties of the materials, encompassing electrical resistivity, Seebeck coefficient, and thermal conductivity within the temperature range of 300 K to 873 K, have been evaluated. The Bi0.001Cu2Se0.90Te0.10 sample exhibited a peak Seebeck coefficient of 192.6 μV/K, which is approximately 23.5% higher than that of the bulk Bi0.001Cu2Se alloy. Both Bi0.001Cu2Se and Bi0.001Cu2Se0.90Te0.10 demonstrated comparable high power factors of 1221.9 μWm− 1K− 2 and 1223.6 μWm− 1K− 2, attributed to their moderate electronic conductivity and Seebeck coefficient. The porous Bi0.001Cu2Se0.80Te0.20 samples exhibited a minimum thermal conductivity of 0.61− 1 K− 1 at 873 K, representing a reduction of up to 21.8% compared to the bulk Bi0.001Cu2Se alloy. This decrease in thermal conductivity can be attributed to the boundaries and defects formed during the spark plasma sintering process, as well as the porous nature of the samples. The figure of merit for the Bi0.001Cu2Se0.80Te0.20 was found to have a maximum value of approximately 1.49 at 873 K, primarily due to its significantly lower thermal conductivity.

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掺杂碲化物以调整硒化铜基材料的晶体结构和热电性能
声子-液态电子晶体原型 β-Cu2Se 因其超低的晶格热导率 (κ),已被公认为性能最佳的热电材料之一。本文报道了通过球磨和火花等离子烧结相结合的方法合成掺杂碲化镉的 Bi0.001Cu2Se。评估了材料在 300 K 至 873 K 温度范围内的热电性能,包括电阻率、塞贝克系数和热导率。Bi0.001Cu2Se0.90Te0.10 样品的塞贝克系数峰值为 192.6 μV/K,比块状 Bi0.001Cu2Se 合金的塞贝克系数高出约 23.5%。Bi0.001Cu2Se 和 Bi0.001Cu2Se0.90Te0.10 都表现出 1221.9 μWm- 1K- 2 和 1223.6 μWm- 1K- 2 的高功率因数,这归功于它们适中的电子导电性和塞贝克系数。多孔 Bi0.001Cu2Se0.80Te0.20 样品在 873 K 时的最低热导率为 0.61- 1 K- 1,与块状 Bi0.001Cu2Se 合金相比降低了 21.8%。热导率的降低可归因于火花等离子烧结过程中形成的边界和缺陷以及样品的多孔性。在 873 K 时,Bi0.001Cu2Se0.80Te0.20 的优点系数最大值约为 1.49,这主要是由于其热导率明显较低。
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来源期刊
Applied Physics A
Applied Physics A 工程技术-材料科学:综合
CiteScore
4.80
自引率
7.40%
发文量
964
审稿时长
38 days
期刊介绍: Applied Physics A publishes experimental and theoretical investigations in applied physics as regular articles, rapid communications, and invited papers. The distinguished 30-member Board of Editors reflects the interdisciplinary approach of the journal and ensures the highest quality of peer review.
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