{"title":"Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain","authors":"Tae Yeob Kang , Haebom Lee , Sungho Suh","doi":"10.1016/j.microrel.2024.115518","DOIUrl":null,"url":null,"abstract":"<div><div>Fault detection and diagnosis of the interconnects are crucial for prognostics and health management (PHM) of electronics. Traditional methods, which rely on electronic signals as prognostic factors, often struggle to accurately identify the root causes of defects without resorting to destructive testing. Furthermore, these methods are vulnerable to noise interference, which can result in false alarms. To address these limitations, in this paper, we propose a novel, non-destructive approach for early fault detection and accurate diagnosis of interconnect defects, with improved noise resilience. Our approach uniquely utilizes the signal patterns of the reflection coefficient across a range of frequencies, enabling both root cause identification and severity assessment. This approach departs from conventional time-series analysis and effectively transforms the signal data into a format suitable for advanced learning algorithms. Additionally, we introduce a novel severity rating ensemble learning (SREL) approach, which enhances diagnostic accuracy and robustness in noisy environments. Experimental results demonstrate that the proposed method is effective for fault detection and diagnosis and has the potential to extend to real-world industrial applications.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424001987","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Fault detection and diagnosis of the interconnects are crucial for prognostics and health management (PHM) of electronics. Traditional methods, which rely on electronic signals as prognostic factors, often struggle to accurately identify the root causes of defects without resorting to destructive testing. Furthermore, these methods are vulnerable to noise interference, which can result in false alarms. To address these limitations, in this paper, we propose a novel, non-destructive approach for early fault detection and accurate diagnosis of interconnect defects, with improved noise resilience. Our approach uniquely utilizes the signal patterns of the reflection coefficient across a range of frequencies, enabling both root cause identification and severity assessment. This approach departs from conventional time-series analysis and effectively transforms the signal data into a format suitable for advanced learning algorithms. Additionally, we introduce a novel severity rating ensemble learning (SREL) approach, which enhances diagnostic accuracy and robustness in noisy environments. Experimental results demonstrate that the proposed method is effective for fault detection and diagnosis and has the potential to extend to real-world industrial applications.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.