{"title":"Enhancing thermal conductivity of AlN ceramics via vat photopolymerization through refractive index coupling and oxygen fixation","authors":"","doi":"10.1016/j.addma.2024.104522","DOIUrl":null,"url":null,"abstract":"<div><div>Despite the growing development of ceramic fabrication by vat photopolymerization (VP), major gaps remain in application. Particularly in the case of VP-printed aluminum nitride (AlN) ceramic, the thermal conductivity is still below 170 W·m<sup>−1</sup>·K<sup>−1</sup>, a critical benchmark for efficient heat dissipation. To address this challenge, here we prepared an AlN slurry with high curing thickness through RI coupling between liquid-solid phase, and took into account of the rheological property under high solid loading. Full dense AlN green bodies with solid loading up to 50 vol% were successfully printed. Aiming to to tackle the degradation of thermal conductivity issue caused by oxygen increment of AlN via VP, we systemically studied the form of oxygen in AlN preparation processes. Through the sintering optimization, the oxygen element from the hydrolysis of AlN surface was fixated in the sintering aid Y<sub>2</sub>O<sub>3</sub>. Eventually, without any special process control or additional treatment, the final sintered AlN ceramics prepared by the developed slurry present a full densification and the highest thermal conductivity (up to 187.9 W∙m<sup>−1</sup>∙K<sup>−1</sup>) of any known additive manufactured ceramics.</div></div>","PeriodicalId":7172,"journal":{"name":"Additive manufacturing","volume":null,"pages":null},"PeriodicalIF":10.3000,"publicationDate":"2024-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214860424005682","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Despite the growing development of ceramic fabrication by vat photopolymerization (VP), major gaps remain in application. Particularly in the case of VP-printed aluminum nitride (AlN) ceramic, the thermal conductivity is still below 170 W·m−1·K−1, a critical benchmark for efficient heat dissipation. To address this challenge, here we prepared an AlN slurry with high curing thickness through RI coupling between liquid-solid phase, and took into account of the rheological property under high solid loading. Full dense AlN green bodies with solid loading up to 50 vol% were successfully printed. Aiming to to tackle the degradation of thermal conductivity issue caused by oxygen increment of AlN via VP, we systemically studied the form of oxygen in AlN preparation processes. Through the sintering optimization, the oxygen element from the hydrolysis of AlN surface was fixated in the sintering aid Y2O3. Eventually, without any special process control or additional treatment, the final sintered AlN ceramics prepared by the developed slurry present a full densification and the highest thermal conductivity (up to 187.9 W∙m−1∙K−1) of any known additive manufactured ceramics.
期刊介绍:
Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects.
The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.