Haolan Qu , Wei Huang , Yu Zhang , Jin Sui , Ge Yang , Jiaxiang Chen , David Wei Zhang , Yuangang Wang , Yuanjie Lv , Zhihong Feng , Xinbo Zou
{"title":"Effect of 5 MeV proton irradiation on electrical and trap characteristics of β-Ga2O3 power diode","authors":"Haolan Qu , Wei Huang , Yu Zhang , Jin Sui , Ge Yang , Jiaxiang Chen , David Wei Zhang , Yuangang Wang , Yuanjie Lv , Zhihong Feng , Xinbo Zou","doi":"10.1016/j.mssp.2024.109121","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, impact of 5 MeV proton irradiation with radiation fluence of 10<sup>13</sup> cm<sup>−2</sup> on <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> power diode is investigated by a <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> Schottky barrier diode (SBD). Via temperature-dependent measurements, carrier removal rate <em>R</em><sub><em>C</em></sub> is determined to be 7.26 × 10<sup>2</sup> cm<sup>−1</sup> at 300 K. Meanwhile, the threshold voltage (<em>V</em><sub><em>on</em></sub>) and ideality factor (<em>n</em>) almost remain stable after proton irradiation. A close-to-unity <em>n</em> was observed for a wide temperature range indicating near-ideal Schottky characteristics. Dynamic degradation was observed at 300K, but was greatly suppressed at a low temperature of 100K. Meanwhile, two more bulk traps are discovered in proton irradiated <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> SBD by deep-level transient spectroscopy (DLTS). The larger corrected trap concentration (<em>N</em><sub><em>Ta</em></sub>) in proton irradiated <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> SBD was regarded as the reason behind slightly worsened dynamic on-resistance instability at 300 K. Furthermore, lower low frequency noise is revealed for proton irradiated device at room temperature and cryogenic temperature. The study demonstrates the competitive irradiation hardness of <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> power diodes and paves a solid path for the deployment of <em>β</em>-Ga<sub>2</sub>O<sub>3</sub> in space.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"187 ","pages":"Article 109121"},"PeriodicalIF":4.2000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800124010175","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, impact of 5 MeV proton irradiation with radiation fluence of 1013 cm−2 on β-Ga2O3 power diode is investigated by a β-Ga2O3 Schottky barrier diode (SBD). Via temperature-dependent measurements, carrier removal rate RC is determined to be 7.26 × 102 cm−1 at 300 K. Meanwhile, the threshold voltage (Von) and ideality factor (n) almost remain stable after proton irradiation. A close-to-unity n was observed for a wide temperature range indicating near-ideal Schottky characteristics. Dynamic degradation was observed at 300K, but was greatly suppressed at a low temperature of 100K. Meanwhile, two more bulk traps are discovered in proton irradiated β-Ga2O3 SBD by deep-level transient spectroscopy (DLTS). The larger corrected trap concentration (NTa) in proton irradiated β-Ga2O3 SBD was regarded as the reason behind slightly worsened dynamic on-resistance instability at 300 K. Furthermore, lower low frequency noise is revealed for proton irradiated device at room temperature and cryogenic temperature. The study demonstrates the competitive irradiation hardness of β-Ga2O3 power diodes and paves a solid path for the deployment of β-Ga2O3 in space.
期刊介绍:
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