Effect of rapid interfacial moisture penetration on moisture distribution within adhesive layers

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-11-24 DOI:10.1016/j.matlet.2024.137768

Jin-Woo Han , Yu Sekiguchi , Kazumasa Shimamoto , Haruhisa Akiyama , Chiaki Sato

{"title":"Effect of rapid interfacial moisture penetration on moisture distribution within adhesive layers","authors":"Jin-Woo Han , Yu Sekiguchi , Kazumasa Shimamoto , Haruhisa Akiyama , Chiaki Sato","doi":"10.1016/j.matlet.2024.137768","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, we numerically calculated the moisture distribution through the thickness of the adhesive layer in an adhesive joint and considered rapid interfacial moisture diffusion. Additionally, the effects of the diffusion coefficient and layer thickness were investigated. An accurate understanding of moisture diffusion in adhesive joints is essential for enhancing their long-term performance and reliability, particularly in applications demanding high environmental durability. However, the moisture behavior near interfaces, which causes faster moisture penetration into the adhesive layer than into the bulk is still not clearly understood. In this study, a model was developed using the finite difference method, considering both bulk and interfacial diffusion properties. The diffusion coefficient near the interface was back-calculated using the experimentally measured moisture distribution in the adhesive layer, which revealed that the moisture distribution in the thickness direction was almost uniform for thin adhesive layers, and parabolic distribution became more pronounced as the adhesive layer became thicker.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"381 ","pages":"Article 137768"},"PeriodicalIF":2.7000,"publicationDate":"2024-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24019086","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

In this study, we numerically calculated the moisture distribution through the thickness of the adhesive layer in an adhesive joint and considered rapid interfacial moisture diffusion. Additionally, the effects of the diffusion coefficient and layer thickness were investigated. An accurate understanding of moisture diffusion in adhesive joints is essential for enhancing their long-term performance and reliability, particularly in applications demanding high environmental durability. However, the moisture behavior near interfaces, which causes faster moisture penetration into the adhesive layer than into the bulk is still not clearly understood. In this study, a model was developed using the finite difference method, considering both bulk and interfacial diffusion properties. The diffusion coefficient near the interface was back-calculated using the experimentally measured moisture distribution in the adhesive layer, which revealed that the moisture distribution in the thickness direction was almost uniform for thin adhesive layers, and parabolic distribution became more pronounced as the adhesive layer became thicker.

Abstract Image

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

界面湿气快速渗透对粘合剂层内湿气分布的影响

在这项研究中，我们通过数值计算了粘接接头中通过粘接层厚度的湿度分布，并考虑了界面湿度的快速扩散。此外，还研究了扩散系数和层厚度的影响。准确了解粘合剂接头中的湿气扩散对于提高其长期性能和可靠性至关重要，尤其是在对环境耐久性要求较高的应用中。然而，对于界面附近的湿气行为，即湿气渗入粘合剂层的速度快于渗入粘合剂层的速度，目前还没有清楚的认识。在这项研究中，使用有限差分法建立了一个模型，同时考虑了主体和界面的扩散特性。利用实验测量的粘合剂层中的水分分布反算了界面附近的扩散系数，结果表明，对于较薄的粘合剂层，水分在厚度方向上的分布几乎是均匀的，随着粘合剂层变厚，抛物线分布变得更加明显。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive