3-D Simulation of Conducted EMI for Automotive Lighting Systems

IF 0.9 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Letters on Electromagnetic Compatibility Practice and Applications Pub Date : 2024-11-12 DOI:10.1109/LEMCPA.2024.3495985
Juan J. Santaella;Safae El-Amrani;Antonio Illán;Pablo Padilla;Juan F. Valenzuela;David Boudikian;Mario F. Pantoja
{"title":"3-D Simulation of Conducted EMI for Automotive Lighting Systems","authors":"Juan J. Santaella;Safae El-Amrani;Antonio Illán;Pablo Padilla;Juan F. Valenzuela;David Boudikian;Mario F. Pantoja","doi":"10.1109/LEMCPA.2024.3495985","DOIUrl":null,"url":null,"abstract":"Full-wave simulations of lighting systems in the automotive industry remain as a computational challenge for electromagnetic compatibility (EMC) purposes. This is mainly due to the need to simulate complex nonlinear electronic systems in computationally large environments. In this letter, we present a numerical procedure that accurately predicts conducted electromagnetic interference (EMI) in such systems. This procedure is based on the concurrent use of electronic-electromagnetic solvers linked by multiple source ports characterized in terms of S- and Y-parameters. Numerical results are validated, using a feature-selective validation (FSV) algorithm, when confronted with measurements taken at the input terminals of the line impedance stabilization network (LISN). Further representation of currents on the main board demonstrates the unique ability of full-wave simulations to provide their physical distribution, a result of interest not only for EMC purposes but also for further structural and thermal validations.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"6 4","pages":"160-165"},"PeriodicalIF":0.9000,"publicationDate":"2024-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10750865/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Full-wave simulations of lighting systems in the automotive industry remain as a computational challenge for electromagnetic compatibility (EMC) purposes. This is mainly due to the need to simulate complex nonlinear electronic systems in computationally large environments. In this letter, we present a numerical procedure that accurately predicts conducted electromagnetic interference (EMI) in such systems. This procedure is based on the concurrent use of electronic-electromagnetic solvers linked by multiple source ports characterized in terms of S- and Y-parameters. Numerical results are validated, using a feature-selective validation (FSV) algorithm, when confronted with measurements taken at the input terminals of the line impedance stabilization network (LISN). Further representation of currents on the main board demonstrates the unique ability of full-wave simulations to provide their physical distribution, a result of interest not only for EMC purposes but also for further structural and thermal validations.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
汽车照明系统传导电磁干扰的三维仿真
汽车工业照明系统的全波模拟仍然是电磁兼容性(EMC)目的的计算挑战。这主要是由于需要在计算量大的环境中模拟复杂的非线性电子系统。在这封信中,我们提出了一个精确预测传导电磁干扰(EMI)的数值程序。该程序是基于同时使用由S和y参数特征的多个源端口连接的电子电磁求解器。在面对线路阻抗稳定网络(LISN)输入端测量时,使用特征选择验证(FSV)算法对数值结果进行了验证。主板上电流的进一步表示表明了全波模拟提供其物理分布的独特能力,这不仅是出于EMC目的,也是为了进一步的结构和热验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
相关文献
Melt-Extruded Sensory Fibers for Electronic Textiles
IF 3.9 3区 材料科学Macromolecular Materials and EngineeringPub Date : 2021-12-15 DOI: 10.1002/mame.202100737
Jordan Tabor, Brendan Thompson, Talha Agcayazi, Alper Bozkurt, Tushar K. Ghosh
Melt-Extruded Sensory Fibers for Electronic Textiles
IF 3.9 3区 材料科学Macromolecular Materials and EngineeringPub Date : 2022-03-14 DOI: 10.1002/mame.202270011
Jordan Tabor, Brendan Thompson, Talha Agcayazi, Alper Bozkurt, Tushar K. Ghosh
New melt-processable thermoplastic polyimides for opto-electronic applications
IF 0 Other ConferencesPub Date : 2012-10-19 DOI: 10.1117/12.927984
Aditya Narayanan, Gurulingamurthy M. Haralur
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Front Cover Table of Contents Synopsis of the March 2025 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications IEEE ELECTROMAGNETIC COMPATIBILITY SOCIETY The Challenge of Surge Protection for LiFePO4 Batteries Using Varistors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1