Xiaoyu Pan;Jinxin Zhang;Xin Wang;Fei Guo;Dongning Hao;Hongxia Guo;Yahui Feng;Yijun Cui;Weiqiang Liu
{"title":"Comparison of Single-Event Transient Under Heavy Ion and Pulsed Laser Irradiation in SiGe HBT Ultrawideband LNA","authors":"Xiaoyu Pan;Jinxin Zhang;Xin Wang;Fei Guo;Dongning Hao;Hongxia Guo;Yahui Feng;Yijun Cui;Weiqiang Liu","doi":"10.1109/TED.2024.3493068","DOIUrl":null,"url":null,"abstract":"This article presents a comprehensive study of single-event effects (SEEs) in a three-stage Silicon Germanium heterojunction bipolar transistors (SiGe HBTs)-based ultrawideband low-noise amplifier (UWB LNA) under heavy ion and pulsed laser irradiation. The study aims to evaluate the circuit’s susceptibility to radiation-induced transients and compare the characteristics of single-event transients (SETs) induced by different irradiation methods. Utilizing single-photon absorption (SPA) laser microbeam testing, SET waveforms were captured at various amplifier stages, revealing stage-specific, frequency-dependent responses. This approach provided a novel method for localizing SET generation, which was validated by subsequent heavy-ion broad beam experiments. Joint device- and circuit-level simulations were performed to investigate the underlying mechanisms, offering insights into the impact of interstage compensation on performance degradation and uncovering SET propagation dynamics within the three-stage UWB LNA. The results show that combining heavy ion and pulsed laser irradiation enables a more comprehensive understanding of SEE behavior in UWB LNAs, offering valuable implications for the design of radiation-hardened circuits in space applications. The experimental and simulation methods outlined in this article can be extended to SET studies in other RF integrated circuits (RF ICs).","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"4-11"},"PeriodicalIF":2.9000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10752996/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents a comprehensive study of single-event effects (SEEs) in a three-stage Silicon Germanium heterojunction bipolar transistors (SiGe HBTs)-based ultrawideband low-noise amplifier (UWB LNA) under heavy ion and pulsed laser irradiation. The study aims to evaluate the circuit’s susceptibility to radiation-induced transients and compare the characteristics of single-event transients (SETs) induced by different irradiation methods. Utilizing single-photon absorption (SPA) laser microbeam testing, SET waveforms were captured at various amplifier stages, revealing stage-specific, frequency-dependent responses. This approach provided a novel method for localizing SET generation, which was validated by subsequent heavy-ion broad beam experiments. Joint device- and circuit-level simulations were performed to investigate the underlying mechanisms, offering insights into the impact of interstage compensation on performance degradation and uncovering SET propagation dynamics within the three-stage UWB LNA. The results show that combining heavy ion and pulsed laser irradiation enables a more comprehensive understanding of SEE behavior in UWB LNAs, offering valuable implications for the design of radiation-hardened circuits in space applications. The experimental and simulation methods outlined in this article can be extended to SET studies in other RF integrated circuits (RF ICs).
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.