Proposal of a Simple Numerical Method for Determining the Height of the Schottky Barrier at Metal–Semiconductor Junctions

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2025-01-15 DOI:10.1109/TED.2024.3519062
Krzysztof Jóźwikowski;Alina Jóźwikowska
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Abstract

Using a 2-D energy band model for electrons on metal surfaces, the value of surface electrical potential was determined. This potential depends on the work function, the concentration of conduction electrons in the metal, and the electron effective mass in surface 2-D band. The spatial distributions of electrical potential were calculated in thermal equilibrium in cylindrical structures of different semiconductors with Al contacts and considered surface states that accumulate surface charge. The electrical potential difference between the metal surface and the interior of the semiconductor constitutes the Schottky barrier (SB). The results of our calculations are in good agreement with the experimental data and confirm the fact that simple Schottky-Mott theory cannot be used to calculate the height of the SB. Calculations were performed for the structure Hg0.78Cd0.22Te at ${T} =77$ K, as well as CdTe and GaAs at ${T} =300$ K. The estimated effective mass of electrons in the surface 2-D band for aluminum is ${m}_{e}\approx {1.16}{m}_{{0}}$ .
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一种确定金属-半导体结肖特基势垒高度的简单数值方法的提出
利用金属表面电子的二维能带模型,确定了金属表面电势的值。该电势取决于功函数、金属中导电电子的浓度和表面二维带中电子的有效质量。计算了具有Al接触的不同半导体圆柱形结构中热平衡电位的空间分布,并考虑了表面电荷积累的表面态。金属表面和半导体内部的电位差构成肖特基势垒(SB)。我们的计算结果与实验数据很好地吻合,证实了简单的肖特基-莫特理论不能用于计算SB的高度。对${T} =77$ K的Hg0.78Cd0.22Te结构以及${T} =300$ K的CdTe和GaAs进行了计算,估计铝表面二维带电子的有效质量为${m}_{e}\约为{1.16}{m}_{{0}}$。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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