Enhancing Hydrogen Evolution Reaction through Coalescence-Induced Bubble Departure on Patterned Gold–Silicon Microstrip Surfaces

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Applied Materials & Interfaces Pub Date : 2025-01-17 DOI:10.1021/acsami.4c18255
Chung-Te Huang, Liangwei Zheng, Yiding Zhong, Jörg G. Werner, Ming-Chang Lu, Chuanhua Duan
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Abstract

Hydrogen bubble adhesion to the electrode presents a major obstacle for green hydrogen generation via the hydrogen evolution reaction (HER) as it would induce undesired overpotential and undermine the reaction efficiency by reducing reaction area, increasing transport resistance, and creating an undesired ion concentration gradient. While electrodes with aerophobic/hydrophilic surfaces have been developed to facilitate bubble detachment, they primarily rely on micro- and nanostructured catalyst surfaces to enhance buoyance-induced bubble departure. Here, we demonstrate that introducing nonreactive yet more hydrophilic surfaces can promote coalescence-induced bubble departure, thereby significantly reducing the transport overpotential and improving HER performance. Through a systematic study using patterned gold–silicon microstrip (GSM) surfaces with varied gold strip widths (50–1600 μm), we found that reducing the gold strip width results in a smaller bubble departure diameter and increased bubble departure frequencies, leading to a 400 mV reduction in transport overpotential at 400 mA/cm2 on 50 μm wide GSM surfaces. These patterned surfaces demonstrated superior HER performance compared to a plain gold surface, even with a 50% reduction in the reaction area. The optimal HER performance, characterized by the lowest total overpotential, was achieved on GSM surfaces with 200 μm wide gold strips, highlighting the intricate interplay between improved bubble dynamics and reduced reaction area.

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金-硅微带表面聚结诱导气泡偏离增强析氢反应
氢气泡粘附在电极上是通过析氢反应(HER)产生绿色氢气的主要障碍,因为它会通过减少反应面积、增加运输阻力和产生不希望的离子浓度梯度来诱导不希望的过电位并破坏反应效率。虽然已经开发出具有疏气/亲水表面的电极来促进气泡脱离,但它们主要依赖于微纳米结构的催化剂表面来增强浮力诱导的气泡脱离。在这里,我们证明了引入非反应性但更亲水的表面可以促进聚结诱导的气泡离开,从而显著降低运输过电位并提高HER性能。通过对具有不同金条宽度(50 - 1600 μm)的图案金硅微带(GSM)表面的系统研究,我们发现减小金条宽度可以减小气泡偏离直径和增加气泡偏离频率,从而导致在50 μm宽的GSM表面上400 mA/cm2的输运过电位降低400 mV。与普通金表面相比,这些图案表面显示出优越的HER性能,即使反应面积减少了50%。在200 μm宽金带的GSM表面上实现了最佳的HER性能,其特点是总过电位最低,突出了气泡动力学改善和反应面积减少之间复杂的相互作用。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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