In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering

IF 4.7 1区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING Transactions of Nonferrous Metals Society of China Pub Date : 2025-01-01 DOI:10.1016/S1003-6326(24)66666-5
Yuan-xing LI, Xiang-bo ZHENG, Chao-zheng ZHAO, Zong-tao ZHU, Yu-jie BAI, Hui CHEN
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引用次数: 0

Abstract

To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints, Al−60Si alloy was joined by ultrasonic soldering with Sn–9Zn solder, and a sound joint with in-situ Si particle reinforcement was obtained. The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy (TEM) analysis as amorphous Al2O3. The oxide of Si particles in the base metal was also alumina. The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment. Si particle-reinforced joints (35.7 vol.%) were obtained by increasing the ultrasonication time. The maximum shear strength peaked at 99.5 MPa for soldering at 330 °C with an ultrasonic vibration time of 50 s. A model of forming of Si particles reinforced joint under the ultrasound was proposed, and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
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来源期刊
CiteScore
7.40
自引率
17.80%
发文量
8456
审稿时长
3.6 months
期刊介绍: The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.
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