Chen-Nan Sun , Beng Loon Aw , Hengfeng Gu , Danny Ming Tak Choi , Chong Teng , Sharon Mui Ling Nai , Aravind Vasanthakumar , Chengcheng Wang
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引用次数: 0
Abstract
Laser powder bed fusion (LPBF) is at the forefront of the additive manufacturing industry due to its ability to generate intricate and accurate objects layer-by-layer. However, maintaining low porosity (i.e., minimizing defects) remains a significant challenge. This study investigates the influence of spatial variations on porosity, independent of processing parameters, by fabricating SS316L cubes at various locations on the build platform with both identical and varying processing parameters (laser power and scan speed). Changes in printing location affect the incident angle between the surface normal and the laser, potentially leading to laser spot distortion and altered effective energy input. This, in turn, can influence the porosity of the printed part. Additionally, improper inert gas flow can hinder spatter removal, further increasing porosity. We demonstrate that, regardless of processing parameters, spatial variations on the build platform significantly impact porosity distribution. Our findings, consistent with existing literature, highlight the importance of optimizing both build location and processing parameters to achieve low porosity, particularly at the platform's periphery. By analyzing the optimal build locations and parameter combinations, this work provides valuable insights for LPBF practitioners seeking to minimize porosity and improve printing outcomes at peripheral regions.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.