Chuqian Zhu, Na Bai, Yufan Wang, Huajun Sun, Lanqing Zou, Yunhui Yi, Jiyang Xu, Jiawang Ren, Junming Zhang, Sheng Hu, Kanhao Xue, Lei Ye, Weiming Cheng, Qiang He, Xiangshui Miao
{"title":"Ferroelectric Compensation Effect of the Hard Electrode for the HfO2-ZrO2 Superlattice Films at the Low-Annealing Temperature","authors":"Chuqian Zhu, Na Bai, Yufan Wang, Huajun Sun, Lanqing Zou, Yunhui Yi, Jiyang Xu, Jiawang Ren, Junming Zhang, Sheng Hu, Kanhao Xue, Lei Ye, Weiming Cheng, Qiang He, Xiangshui Miao","doi":"10.1002/aelm.202400830","DOIUrl":null,"url":null,"abstract":"This study investigates the ferroelectric (FE) performance of [HfO<sub>2</sub>/ZrO<sub>2</sub>]<sub>6</sub> superlattice FE capacitors using different top electrodes (TE). The unidirectional rapid thermal annealing (RTA) process from 450 to 600 °C is conducted. The device's remanent polarization (<i>P<sub>r</sub></i>) improved with TE hardness, and is maintained with harder TE at lower temperature. Furthermore, the superlattice's endurance and the recovery feature improve with harder TE. The increased orthorhombic phase (o-phase) content and the decreased tetragonal phase (t-phase) content indicate that the hard TE's out-of-plane stress at the interface suppressed the phase transition from the t-phase to the monoclinic phase (m-phase) and promotes the o-phase formation. It's known that hard electrodes usually have low coefficient of thermal expansion (CTE), which can generate high in-plane tensile strain optimizing the FE properties, so the lower-CTE electrodes devices’ FE performances are expected to degrade more with temperature decreasing, which is opposite with the experimental results. Therefore, hard electrodes can generate high out-of-plane compressive stress to offset the reduced in-plane tensile stress, leading to a FE compensation effect in low temperature thermal process.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"23 1","pages":""},"PeriodicalIF":5.3000,"publicationDate":"2025-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/aelm.202400830","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the ferroelectric (FE) performance of [HfO2/ZrO2]6 superlattice FE capacitors using different top electrodes (TE). The unidirectional rapid thermal annealing (RTA) process from 450 to 600 °C is conducted. The device's remanent polarization (Pr) improved with TE hardness, and is maintained with harder TE at lower temperature. Furthermore, the superlattice's endurance and the recovery feature improve with harder TE. The increased orthorhombic phase (o-phase) content and the decreased tetragonal phase (t-phase) content indicate that the hard TE's out-of-plane stress at the interface suppressed the phase transition from the t-phase to the monoclinic phase (m-phase) and promotes the o-phase formation. It's known that hard electrodes usually have low coefficient of thermal expansion (CTE), which can generate high in-plane tensile strain optimizing the FE properties, so the lower-CTE electrodes devices’ FE performances are expected to degrade more with temperature decreasing, which is opposite with the experimental results. Therefore, hard electrodes can generate high out-of-plane compressive stress to offset the reduced in-plane tensile stress, leading to a FE compensation effect in low temperature thermal process.
期刊介绍:
Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.