Preparation and arc erosion behavior of Ag-CFs contact materials with different CFs contents

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-02-20 DOI:10.1007/s10854-025-14424-8
Chong Fu, Shengbo Man, Yuxin Liu, Ruikang Xiao, Yanli Chang, Ting Zhang, Jing Zheng
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引用次数: 0

Abstract

The incorporation of reinforcement phases is essential for enhancing the arc erosion resistance and anti-welding properties of silver (Ag)-based contact materials. However, the mechanism by which carbon fibers (CFs) affect the arc erosion behavior of the Ag matrix is not yet clear. In this study, Ag-based contact materials containing CFs were produced using a series of techniques, including electroless plating, ball milling, and the powder metallurgy method. The effect of CFs content on the arc erosion behavior of Ag-CFs contact materials was investigated. The results indicate that the interface between the copper (Cu)-plated CFs and the Ag matrix is tightly bonded. As the content of the Cu-plated CFs increases, the relative densities and conductivities of the materials decrease, and the hardness initially increases and then decreases. Experiments have shown that adding CFs could improve arc erosion resistance. Specifically, Ag-3.7 vol% CFs contact materials maintain relatively stable and low average arc energy and average arc time. The direction of material transfer is from the anode to the cathode, and the amount transferred is relatively minimal. The outcomes of this study provide a novel methodology for the development of Ag-C contact materials and pave the way for further investigations into the electrical properties of Ag-CFs contact materials

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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