{"title":"Vibration attenuation of a PCB enclosure in a radar system employing internal particle dampers","authors":"Sunil Kumar, Anil Kumar","doi":"10.1007/s10999-024-09730-8","DOIUrl":null,"url":null,"abstract":"<div><p>Vibration can damage sensitive components and mountings on printed circuit boards (PCBs) within active electronically scanned array radar transmit/receive modules, which can result in reduced system performance and system failure. To solve this issue, a novel vibration reduction measure by incorporating particle dampers within the PCB enclosure is proposed. To install particle dampers, finite element-based modal analysis was performed to identify vibration-sensitive areas inside the structure. The dominant modal frequency was validated with a sinusoidal sweep test performed on a vibration shaker. Based on these results and spatial constraints, two cavities were created for particle damper installation: one near the sensitive area (damper A) and another farther away (damper B). Steel particles of varying sizes, i.e. 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, and 3.5 mm, were used to fill these cavities. Experimental investigations were conducted to evaluate the effect of particle size and filling ratio on peak vibration response under different acceleration loads. Both dampers achieved the best response reductions with a 2.5 mm particle size, though their critical filling ratios differed: 92% for damper A and 96% for damper B. The findings indicate an 89% and 64% reduction in acceleration response with dampers A and B, respectively. This novel method of integrating particle dampers within the housing enhances its vibration suppression capabilities and provides superior response reductions compared to the previous approach of mounting them on the periphery. Furthermore, the method is reliable even in elevated temperature environments due to the use of metallic particles.</p></div>","PeriodicalId":593,"journal":{"name":"International Journal of Mechanics and Materials in Design","volume":"21 1","pages":"137 - 153"},"PeriodicalIF":2.7000,"publicationDate":"2024-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Mechanics and Materials in Design","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10999-024-09730-8","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Vibration can damage sensitive components and mountings on printed circuit boards (PCBs) within active electronically scanned array radar transmit/receive modules, which can result in reduced system performance and system failure. To solve this issue, a novel vibration reduction measure by incorporating particle dampers within the PCB enclosure is proposed. To install particle dampers, finite element-based modal analysis was performed to identify vibration-sensitive areas inside the structure. The dominant modal frequency was validated with a sinusoidal sweep test performed on a vibration shaker. Based on these results and spatial constraints, two cavities were created for particle damper installation: one near the sensitive area (damper A) and another farther away (damper B). Steel particles of varying sizes, i.e. 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, and 3.5 mm, were used to fill these cavities. Experimental investigations were conducted to evaluate the effect of particle size and filling ratio on peak vibration response under different acceleration loads. Both dampers achieved the best response reductions with a 2.5 mm particle size, though their critical filling ratios differed: 92% for damper A and 96% for damper B. The findings indicate an 89% and 64% reduction in acceleration response with dampers A and B, respectively. This novel method of integrating particle dampers within the housing enhances its vibration suppression capabilities and provides superior response reductions compared to the previous approach of mounting them on the periphery. Furthermore, the method is reliable even in elevated temperature environments due to the use of metallic particles.
期刊介绍:
It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.
Analytical synopsis of contents:
The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:
Intelligent Design:
Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.
Advanced Materials in Design:
Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.
Design Analysis and Optimisation:
Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.