Effect of bonding temperature on the microstructure, IMCs growth, and shear property of Cu/Sn-9Zn-30Cu/Cu solder joint by transient liquid phase bonding

IF 4.3 2区材料科学 Q2 CHEMISTRY, PHYSICAL Intermetallics Pub Date : 2025-03-01 DOI:10.1016/j.intermet.2025.108722

Yang Zheng , Zheng Liu , Haodong Wu , Yucong He , Li Yang , Yaocheng Zhang

{"title":"Effect of bonding temperature on the microstructure, IMCs growth, and shear property of Cu/Sn-9Zn-30Cu/Cu solder joint by transient liquid phase bonding","authors":"Yang Zheng , Zheng Liu , Haodong Wu , Yucong He , Li Yang , Yaocheng Zhang","doi":"10.1016/j.intermet.2025.108722","DOIUrl":null,"url":null,"abstract":"<div><div>In this paper, Cu/Sn-9Zn-30Cu/Cu solder joints were prepared by low-temperature transient liquid phase (TLP) bonding. The effect of bonding temperature on the microstructure, intermetallic compounds (IMCs) growth and shear property of the Cu/Sn-9Zn-30Cu/Cu solder joints was investigated. The results showed the microstructure of the in-situ reaction zone mainly consisted of Cu3(Sn,Zn), Cu6(Sn,Zn)5, Cu particles and Zn-rich phases when the bonding temperature was 260 °C. With increasing bonding temperature, the Cu particles and Zn-rich phases were decreased. The interfacial IMCs were composed of Cu3(Sn,Zn) and Cu6(Sn,Zn)5. The thickness of the interfacial IMCs increased with increasing bonding temperature, while Kirkendall voids were formed at the Cu3(Sn,Zn)/Cu interface. The activation energy of interfacial IMCs was 27.06 kJ/mol. The shear strength of the solder joint reached the maximum value of 17.24 MPa when the bonding temperature increased to 280 °C. When the bonding temperatures were 260 °C and 280 °C, the fracture position of the solder joint was in the in-situ reaction zone. With increasing bonding temperature, the fracture position of the solder joint shifted to the interfacial IMCs, and then returned to the in-situ reaction zone. The fracture mode of all solder joints was brittle fracture.</div></div>","PeriodicalId":331,"journal":{"name":"Intermetallics","volume":"181 ","pages":"Article 108722"},"PeriodicalIF":4.3000,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Intermetallics","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0966979525000871","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}

引用次数: 0

Abstract

In this paper, Cu/Sn-9Zn-30Cu/Cu solder joints were prepared by low-temperature transient liquid phase (TLP) bonding. The effect of bonding temperature on the microstructure, intermetallic compounds (IMCs) growth and shear property of the Cu/Sn-9Zn-30Cu/Cu solder joints was investigated. The results showed the microstructure of the in-situ reaction zone mainly consisted of Cu₃(Sn,Zn), Cu₆(Sn,Zn)₅, Cu particles and Zn-rich phases when the bonding temperature was 260 °C. With increasing bonding temperature, the Cu particles and Zn-rich phases were decreased. The interfacial IMCs were composed of Cu₃(Sn,Zn) and Cu₆(Sn,Zn)₅. The thickness of the interfacial IMCs increased with increasing bonding temperature, while Kirkendall voids were formed at the Cu₃(Sn,Zn)/Cu interface. The activation energy of interfacial IMCs was 27.06 kJ/mol. The shear strength of the solder joint reached the maximum value of 17.24 MPa when the bonding temperature increased to 280 °C. When the bonding temperatures were 260 °C and 280 °C, the fracture position of the solder joint was in the in-situ reaction zone. With increasing bonding temperature, the fracture position of the solder joint shifted to the interfacial IMCs, and then returned to the in-situ reaction zone. The fracture mode of all solder joints was brittle fracture.

Abstract Image

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

求助全文

约1分钟内获得全文去求助

来源期刊

Intermetallics 工程技术-材料科学：综合

CiteScore

7.80

自引率

9.10%

发文量

291

审稿时长

37 days

期刊介绍： This journal is a platform for publishing innovative research and overviews for advancing our understanding of the structure, property, and functionality of complex metallic alloys, including intermetallics, metallic glasses, and high entropy alloys. The journal reports the science and engineering of metallic materials in the following aspects: Theories and experiments which address the relationship between property and structure in all length scales. Physical modeling and numerical simulations which provide a comprehensive understanding of experimental observations. Stimulated methodologies to characterize the structure and chemistry of materials that correlate the properties. Technological applications resulting from the understanding of property-structure relationship in materials. Novel and cutting-edge results warranting rapid communication. The journal also publishes special issues on selected topics and overviews by invitation only.