Optimisation of Ion/Ioff and transconductance of germanium based dual metal gate hetero-dielectric TFET

IF 2.7 Q2 PHYSICS, CONDENSED MATTER Micro and Nanostructures Pub Date : 2025-03-05 DOI:10.1016/j.micrna.2025.208128
D. Gracia , D. Jackuline Moni , D. Nirmal
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Abstract

This simulation study delves in to the exploration of Tunnel Field Effect Transistors (TFET) with Dual Metal Gate (DMG) hetero-dielectric structure incorporating a Germanium channel using simulations study in TCAD. The device efficiency measures such as current in the off-state (Ioff), on-state current (Ion), switching efficiency of the current (Ion/Ioff) are observed for the proposed device. The metrics are taken in comparison with the traditional DMG hetero-dielectric MOSFET. The recommended device exhibits a 74.8 % reduction in the Subthreshold Slope (SS) compared to the traditional DMG hetero-dielectric MOSFET. An enhanced Ion/Ioff ratio of 4.669 × 108for Ge channel TFET is observed over a conventional DMG MOSFET simulated under same environmental conditions. The performance analysis has been carried out for various channel thickness (tch), oxide thickness (tox), tunneling lengths (L1:L2) and different gate metal work functions. A detailed RF analysis for hetero dielectrics with HfO2 near the source area and SiO2 near the drain area is carried out for DMG Hetero Dielectric TFET. It is evident that positioning the low-k dielectric in close proximity to the drain region leads to the suppression of parasitic capacitances such as Cgd and Cgg. This characteristic enhances its suitability as a superior aspirant for nano digital applications.
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Optimisation of Ion/Ioff and transconductance of germanium based dual metal gate hetero-dielectric TFET Editorial Board A 4H–SiC TMOS with triple trenches and high-K dielectric Silicon carbide MOSFETs: A critical review of applications, technological advancements, and future perspectives Editorial Board
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