Numerical and experimental study of transport AC losses in Bi-2223 stacked conductors

IF 1.8 3区 工程技术 Q3 PHYSICS, APPLIED Cryogenics Pub Date : 2025-03-05 DOI:10.1016/j.cryogenics.2025.104054
Jiwei Liu , Yunpeng Zhu , Jing Jiang , Xinsheng Yang , Rui Shen , Lijun Cai , Fanggong Cai , Yong Zhao
{"title":"Numerical and experimental study of transport AC losses in Bi-2223 stacked conductors","authors":"Jiwei Liu ,&nbsp;Yunpeng Zhu ,&nbsp;Jing Jiang ,&nbsp;Xinsheng Yang ,&nbsp;Rui Shen ,&nbsp;Lijun Cai ,&nbsp;Fanggong Cai ,&nbsp;Yong Zhao","doi":"10.1016/j.cryogenics.2025.104054","DOIUrl":null,"url":null,"abstract":"<div><div>In this paper, a 2D multi-physics electromagnetic-thermal coupling model of Bi-2223 stacked conductors was developed, which combined the <strong><em>H</em></strong>-formulation and heat-conduction module. Using the finite element method (FEM), the transport alternating current (AC) losses in Bi-2223 stacked conductors with five different stacking cases were simulated and analyzed to optimize the stacking structure of the conductors, while ensuring a fixed number of Bi-2223 tapes and copper tapes in the stacked conductors. According to the optimized simulation results, three stacked structures with lower transport AC losses were selected and fabricated into three samples of 500 mm in length. The AC losses with transport current were experimentally measured in three different intervals over the length direction of each sample and at three AC frequencies (30 Hz, 45 Hz, and 60 Hz) by electrical measurement method. By comparing numerical simulation results, experimental measurement data and the AC losses computed with Norris analytical formulation, the 2D multi-physics electromagnetic-thermal coupling model developed in this paper was verified for calculating the transport AC losses of Bi-2223 stacked conductors and optimizing the arrangement of the stacked conductors.</div></div>","PeriodicalId":10812,"journal":{"name":"Cryogenics","volume":"147 ","pages":"Article 104054"},"PeriodicalIF":1.8000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Cryogenics","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0011227525000323","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0

Abstract

In this paper, a 2D multi-physics electromagnetic-thermal coupling model of Bi-2223 stacked conductors was developed, which combined the H-formulation and heat-conduction module. Using the finite element method (FEM), the transport alternating current (AC) losses in Bi-2223 stacked conductors with five different stacking cases were simulated and analyzed to optimize the stacking structure of the conductors, while ensuring a fixed number of Bi-2223 tapes and copper tapes in the stacked conductors. According to the optimized simulation results, three stacked structures with lower transport AC losses were selected and fabricated into three samples of 500 mm in length. The AC losses with transport current were experimentally measured in three different intervals over the length direction of each sample and at three AC frequencies (30 Hz, 45 Hz, and 60 Hz) by electrical measurement method. By comparing numerical simulation results, experimental measurement data and the AC losses computed with Norris analytical formulation, the 2D multi-physics electromagnetic-thermal coupling model developed in this paper was verified for calculating the transport AC losses of Bi-2223 stacked conductors and optimizing the arrangement of the stacked conductors.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
求助全文
约1分钟内获得全文 去求助
来源期刊
Cryogenics
Cryogenics 物理-热力学
CiteScore
3.80
自引率
9.50%
发文量
0
审稿时长
2.1 months
期刊介绍: Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics
期刊最新文献
Numerical and experimental study of transport AC losses in Bi-2223 stacked conductors Influence of cryogenic temperatures on DC surface flashover characteristics of BNNS-based epoxy nanocomposites An improved thermal analysis method for vapor-cooled current leads considering convective heat transfer efficiency Modelling the thermal buffer behavior of JT-60SA in case of pulsed heat loads Liquid nitrogen spray injection for direct-contact freeze concentration applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1