A Letter from the Program Chair + Symposium Preview

Abstract

Dear Readers and Display Friends,

On behalf of the Society for Information Display's Program Committee, a warm welcome to Display Week 2025—the 62nd International Symposium, Seminar, and Exhibition—hosted in San Jose, California May 11–16. It is my pleasure to share some highlights from the amazing program planned for this event.

With a record strong global participation from the display industry and academia, the Symposium program has grown to 98 sessions, which requires a full day of sessions on Friday, May 16 to accommodate the increased number of papers.

The Symposium spans a comprehensive array of technical specialties, which you will see in the following preview article. These sessions include a mix of regular, invited, and late-breaking news that will report on the progress and innovations in the industry, including next-generation technologies and applications for displays, sensing, and imaging just to name a few.

Four Special Topics will highlight areas selected for their current strategic importance. “Artificial Intelligence including Machine Learning for Imaging” will feature papers on emerging software techniques transforming display design, manufacturing, and new applications. “Ultra-High Bandwidth Display Data Transmission and Processing” will address key challenges for the future of immersive displays, with higher resolutions and refresh rates compounded with 3D applications in extended reality, holographic, and light field displays. New for 2025, “Heterogeneous Integration for Emerging Applications” will include papers on synergies across flat panel displays and semiconductor manufacturing, unlocking new opportunities in high-performance electronic packaging, next-generation displays, and non-display applications. “Sustainable Displays and Green Technologies” will spotlight global efforts for minimizing the environmental impacts across products’ manufacturing and lifecycles, enabling a bright future with displays benefiting everyone, everywhere for generations to come.

Other opportunities for learning and networking include Short Courses, Seminars, and new for 2025, a “Displays 101” initiative designed for those entering the field. Monday's program will include the annual Business Conference, focusing on supply chain and business topics, and new for 2025, the Computer Vision and AI Conference in partnership with OpenCV, complementing the AI/ML areas in the Symposium. On Tuesday, be sure to attend the highly anticipated keynote presentations and opening of the Exhibit Hall, with great offerings such as the I-Zone and the new XR pavilion (find full information at www.displayweek.org).

I would like to add a big “Thank You!” to our extended team working together behind the scenes to bring you this excellent program. Many volunteers, passionate members of our program committees and special topics teams, the SID Executive Board, and the headquarters team make all this possible. Serving as the 2025 Technical Program Chair has been an honor and pleasure while partnering with the extended team, interacting with so many authors, and helping bring together the exciting progress and creativity from across the global display community.

Thus, I wholeheartedly recommend attending the conference. Especially for students, I hope you will take advantage of the significant registration discounts and use this opportunity to learn about the beautiful world of displays and help us invent the future.

Ion Bita

Technical Program Chair

Compiled by Lori A. Wilson

FOR ANYONE WHO ATTENDS DISPLAY WEEK, it can be quite awe-inspiring. Hundreds of talks and presentations are assigned to designated rooms and times, there is a constant buzz in the impressive exhibition area, and ideas are brimming throughout, whether in private conversations or while witnessing the possibilities in the I-Zone.

But all this innovation and magic, if you will, has a starting point, where the program chairs and general chairs, symposium coordinators, subcommittee chairs, and SID staff congregate to discuss how the pieces will fall into place.

Witnessing the paper selection process is rather fascinating. Dozens of dedicated display specialists congregate to review hundreds of papers and to discuss what topics are not only the most newsworthy or of highest interest, but also those having a large impact on the industry.

With that in mind, this article highlights some of the best work being done in display technology that will be featured at Display Week 2025 in San Jose, California, May 11–16. Although not all-encompassing, its aim is to serve as a symposium guide for meeting attendees who may feel a bit overwhelmed by all the offerings.

Several expanded focus areas will be introduced to explore the rapidly evolving developments in the display industry, which are driving groundbreaking innovations and the emergence of exciting new technologies.

This year, the technical symposium will feature a record-breaking 98 sessions organized by their technical focus.

Some hot topics in this area will focus on thin-film transistor (TFT) technology, including stacked vertical oxide TFTs, progress in polycrystalline oxide TFTs, and high-mobility metal-oxide TFT development for IT active-matrix OLED (AMOLED) applications. Other offerings will include pixel circuits to drive microLED displays and low-power OLED display technology based on a separate driving pixel scheme.

Presentations of interest include one by Mamoru Furuta et al. (Kochi University of Technology/Tokyo Electron Technology Solutions), which will demonstrate the concept of a hydrogen-free amorphous oxide semiconductor TFT to resolve associated instability (70.3). Shou-Zen Chang et al. (Powerchip Semiconductor Manufacturing) will discuss the fabrication of an OLED display by evaporating OLED on the stack, with the display exhibiting normal operation (47.2). And Masataka Nakada et al. (Semiconductor Energy Laboratory) will cover crystal InOx as both a promising replacement for low-temperature polycrystalline oxide (LTPO) in backplanes and as an application to lines for larger glass substrates (77.2).

Two notable posters are one by Sanghyun Heo et al. (Samsung Display), which proposes a 7T1C pixel circuit to minimize the current deviation of a driving transistor (P.8), and another by Jin Jang et al. (Advanced Display Research Center), which discusses a metal insulator semiconductor ferroelectric (MISF)-structured TFT for stretchable backplanes (P.150).

APV received many high-quality papers focused on augmented (AR) and virtual reality (VR) that investigate how to improve the visual experience with new optics.

Some notable presentations will be one by Zong Qin et al. (Sun Yat-Sen University), which will discuss 2D Alvarez lenses to correct defocus and astigmatism (58.4) and another by Chang-Yeong Han et al. (Samsung Display), which will focus on a wholistic evaluation of motion artifacts with low persistence displays (58.1).

There also will be several presentations on color displays, including an invited talk from an applied colorist, Jack Holm (Tarkus Imaging), which will address how creative professionals use wide color gamut (WCG) and high dynamic range (HDR) and possible applied concerns (66.1). Additional presentations will explore some of these topics in depth, including how frequently some of these ultra-saturated colors appear in nature, by Farnaz Agahian and Dale Stolitzka (Samsung Display America Lab) (66.2), and how differences between people can interact with display primaries to produce different color experiences between individuals on WCG displays by Yoojin Kang et al. (LG Display) (66.4).

This area will cover hot topics such as holographic optical elements (HOE), AR/VR optics, waveguides, holographic films, artificial intelligence (AI) and machine learning (ML), and microdisplays (eyeware).

Polarization volume hologram offers several advantages for waveguide-based AR displays, such as higher optical efficiency, wider spectral and angular bandwidths, and lower rainbow effect. However, the fabrication process is a bottleneck. In their invited talk, Cesar Clavero et al. (Intermolecular/Merck KGaA) will address how to establish reproducible and high-throughput deposition and patterning processes to clear the hurdles for mass production (24.1).

Cong Ning et al. (BOE Technology Group) will discuss improving pixel density and reducing single chip cost as ways for microLED to enter mainstream products. They will feature a microLED display screen with up to 6,020 ppi and 4,000 × 4,000 resolution at a size of 0.9 inches that has been designed to showcase size, brightness, and high pixel density (17.4).

Yuki Tamatsukuri et al. (Semiconductor Energy Laboratory) will cover the development of a 90-Hz, 5,009-ppi OLED display that was fabricated by employing an OLED/OS/Si structure in which the pixel array and drivers are monolithically stacked. This will allow AR and VR devices to have a reduced number of integrated circuits (ICs) and smaller housing (17.2).

Other presentations will focus on the mass manufacture of AI, the perfect merge of displays and optics, and how to deal with speed when processing data.

These topics will highlight several innovations in the automotive sector, with many focusing on accessibility and safety. Head-up displays (HUDs) and transparency are big this year, both allowing for convenient ways to digest information while driving. Developments such as contrast improvement, see-through image quality, and local dimming also will be featured.

Markus Weber et al. (Continental Automotive Technologies) will introduce a new metric for panel sensitivity on mechanical torsion. They will cover measurement results for various in-plane switching (IPS) panels with respect to test parameters, disturbing factors, and panel design features (79.1).

Kjell Brunnström et al. (RISE Research Institutes of Sweden) will present an analysis on AR-HUD for aiding drivers in keeping their eyes on the road and how they found greater success using AR guidance compared to conventional HUD (56.3).

Hanwook Chung and Hyunjin Yoo (Forvia IRYStec) will introduce a fully convolutional transformer-based neural architecture for speech emotion recognition for automotives and will discuss how this proposed emotion classification method provides better recognition performance than other benchmark algorithms in a joint session with AIM and ETAP (72.3).

Other presentations will cover electric vehicle (EV) technology, off-angle viewing, switchable privacy, and novel automotive experiences.

Hot topics in this area include advanced display driving circuits, innovative displays, microdisplays, and advanced display applications. Whether discovering methods to improve the stability and accuracy of LCD with ambient light sensors (14.1) or studying an AMOLED source for fast-charge simulation (7.1), these sessions are not short of exciting innovations.

Wan-Nung Tsung et al. (Novatek Microelectronics) will discuss how the color and luminance of OLED panels sometimes shift under different ambient temperatures and how using raw data from sensors to obtain local temperature information, they can employ a proposed compensation method to solve the effects of these shifts (21.2).

Minjae Lee et al. (Gwangju Institute of Science and Technology) will propose an OLED driver IC that meets high resolution, fast response time, low power consumption, and compact size requirements, making it a promising solution for next-generation high-performance OLED display driving applications (7.2).

The presentation by Myunghee Lee and Jonggu Jeon (Sapien Semiconductors) will explore emerging trends in implementing complementary metal-oxide semiconductor (CMOS) backplanes for microLEDoS microdisplays in AR smart glasses. They will address design strategies and trade-offs encountered during backplane development and focus on solutions, such as pixel-level image compensation to enhance production yield and reduce unit costs (43.1).

This topic will feature several areas of interest, including advanced TFT manufacturing, flexible display manufacturing, scaling up of inkjet and organic evaporation sources, and display manufacturing using metal oxide.

A big issue with display manufacturing is defect detection, and several posters and presentations will address this concern by highlighting the function of AI and deep learning in this regard. Choongmin Jeong et al. (Display Research Center, Samsung Display) will discuss the development of an AI model that can effectively replace structural analysis for evaluating reliability (P.45). Posters will address topics such as intelligent defect detection and interception in LCD manufacturing (P.49) and AI-based rapid defect detection methods for display screen appearance (P.42).

Sungmoon Kim et al. (Depolab) will discuss using a triple nozzle revolving evaporation source for red, green, and blue (RGB) direct-patterning OLED-on-silicon (OLEDoS) in mass production. By rotating the source during deposition, they achieved uniform film thickness and homogeneous mixing (47.1).

Seki Park et al. (Samsung Display/Sungkyunkwan University) will explore an optimal solution to release equipment constraints in manufacturing lines using digital twin technology and deep reinforcement learning through a deep Q-network (DQN) algorithm (96.2).

Complicated structures, including display technologies and applications, require complicated ways to measure them. That is what keeps the topic of measurements relevant year after year.

These presentations will feature several areas of interest, including spatial temporal measurement, AR/VR measurement, eye tracking for near-eye displays (NEDs), halo evaluation, VR latency, advanced display measurement, and eyebox evaluation.

Lei Zhao et al. (Yongjiang Laboratory) will propose a testing method for NED systems with eye tracking in the eye rotation test mode. The method involves testing the modulation transfer function (MTF) based on foveated rendering as well as the chromaticity uniformity and color difference before and after compensation (45.4).

Ingo Rotscholl et al. (TechnoTeam Bildverarbeitung) will present and validate an easy-to-setup approach to measure a display's reflection properties. This approach can measure not only the specular, haze, and Lambertian components of reflection, but also the diffractive component (30.1).

Chumin Zhao and Ryan Beams (US Food and Drug Administration) will discuss a bench setup that enables the translation and rotation of a physical target and a head-mounted display (HMD). They will evaluate video see-through (VST) latency and temporo-spatial inaccuracy using various motion schemes involving target and HMD translation and HMD rotation (45.1).

Hot topics in this area will feature novel components and system integration for AR, VR, and mixed reality (MR), 3D displays (e.g., holographic, light field) and their components, projection systems, and backlight units for HDR displays.

Haruki Tsuchiya et al. (Sony Semiconductor Solutions) will report on the key features of an integration process for LED microdisplays for AR applications using copper-to-copper hybridization of a die-to-silicon transferred GaN/Si wafer and a Si CMOS backplane. Their presentation will include a prototype of a 0.26-inch, 5,644 ppi LED microdisplay (38.4).

Kazuaki Takiyama et al. (Utsunomiya University) will propose a high-resolution aerial 3D display based on lens-enhanced aerial imaging through retro-reflections and light-field display constructs (60.1).

In a joint session with IDS, Ying Chen at al. (AUO Corporation) will discuss enhancing the image quality of under-display camera (UDC) technology through a novel panel design and driving method with microLED displays. Their research targets optical diffraction simulation results of various pixel designs to reduce the flare produced when a strong light source passes through the panel (88.1).

Tianyu Wu et al. (North Carolina State University) will evaluate real-time per-pixel predistortion for head-tracked light field displays (60.3).

Jin-Hyeok Seo et al. (Kyungpook National University) will discuss establishing a foundation for overcoming noise issues in full-color imaging by applying a quarter waveplate geometric phase lens (QW-GPL) scheme within a self-interference incoherent digital holography (SIDH) system for dual sets of wavefront modulations (52.2).

These papers will introduce breakthroughs for emerging technologies used in the display industry that are progressing but not yet mainstream, novel applications of displays and related technologies, and unique uses of technologies in non-display applications.

Session 8 introduces four emerging technologies. Wan-Tsang Wang et al. (AUO Corporation) will discuss a novel saddle-shaped display solution for intelligent vehicle cockpits, leveraging stretchable microLED technology to enable freeform designs integrating touch functionality, UDC, and knob display technologies to achieve a compact and functional design (8.1). Hyeon-Su Jeong et al. (Kyungpook National University) will introduce a system to overcome the traditional tradeoffs between depth of field and reconstructed image resolution in light field imaging optics (8.3).

Session 15 features four presentations about novel materials and processes to potentially enable electronic components to be embedded in wearable technology. Jae-won Kim (Hanyang University) will describe a sensor that can visualize human movement in real-time using an ACEL display (15.2).

Sessions 29, 36, and 44 will feature several breakthrough biomedical sensors, technologies, and applications. Bright Walker and Mallory Mativenga from Kyung Hee University will reveal a novel fabrication of electronic noses that mimic olfactory organs by emulating the sense of smell through quantification of volatile organic compounds (29.1). Oliver Durnan (Columbia University) will describe a microLED light source for optical sectioning structured illumination microscopy with a bottom-emitting design to improve the uniformity and intensity of emission (36.4). Cameron Wilson et al. (University of Edinburgh) will report on a novel VR system designed to diagnose cerebral visual impairments, including assessment of visual acuity, visual fields, visual inattention/neglect, and contrast sensitivity (44.3).

Session 99 will highlight four novel x-ray and ultrasound imaging techniques using technology derived from display backplanes. Notable posters include those by Jiangbo Hu et al. (Peking University/TCL CSOT) (P.128) and Qiumei Wei (BOE Technology Group) (P.127).

Highlights in this area will include topics on full-color microLED for NEDs, including those with color conversion by quantum dots (QDs), advancing inkjet-printed electroluminescent (EL) QD displays toward commercialization including inspiring demonstrations, and infrared (IR) imaging and sensing with QDs.

Eric Virey and Raphael Mermet-Lyaudoz (Yole Group) will focus on the breakthroughs needed in terms of technology, manufacturing process, and equipment to help microLED technology deliver a differentiated performance in the industry (59.3).

Soeren Steudel et al. (MICLEDI microdisplay BV/imec vzw) will discuss the impact of confinement effects in microLED displays for AR on color mixing (33.1).

Other presentations of note include one by Jae-In Yoo et al. (Sungkyunkwan University), who will demonstrate approaches to achieving ultrahigh resolution and enhanced color performance in next-generation displays by leveraging dual- and triple-color QLED devices (12.1). Takuro Iizuka et al. (Yamagata University) will discuss the relationship between the substituent space in zwitterionic ligands and the stability of perovskite nanocrystals (67.3). Yizhou Qian et al. (University of Central Florida) will cover how they have optimized continuous multiple quantum-well red AlGaInP microLEDs by modifying the pixel definition layer and implementing moth-eye meta-atoms, increasing light extraction efficiency (33.2). And Dongjin Kang et al. (Samsung Display) will discuss their advanced inkjet printing processes for fabricating high-resolution 264-ppi QD-LED displays (19.2).

Topics of interest in these presentations will include stretchable displays, rollable AMOLED displays, flexible electronics, and tri-fold OLED displays.

Masataka Nakada et al. (Semiconductor Energy Laboratory) will cover how the use of a high-mobility crystal indium-oxide top-gate self-aligned (TGSA) field-effect transistor (FET) in the OLED backplane enables lower power consumption, narrower bezel because of the downsizing of driver circuits, and higher frame rates (77.2).

Hiroshi Tsuji (NHK Science and Technology Research Laboratories) will discuss how they have developed zero-bezel flexible microLED displays using through-plastic vias (TPVs). By using the TPVs to connect signal wires on the front and back sides of a polyimide film, they formed signal input lines on the backside of the display screen, eliminating the bezel (77.1).

Jangyeol Yoon et al. (Samsung Display) will discuss a study that demonstrates a 200-ppi stretchable display by applying a serpentine-shaped bridge design to a microLED base during a conventional display process (85.1).

James Aborn et al. (E Ink Corporation) will cover the development of a full-color electrophoretic display platform with excellent color and contrast ratio performance that targets outdoor signage applications (92.1).

This topic will feature innovations in technology for medical purposes—optical sensors and cardiovascular health monitors—the integration of ambient light sensors, in-cell fingerprint displays, multifunctional haptic displays, and enhanced facial recognition for UDC displays.

Kyusu Ahn et al. (Samsung Display/Seoul National University) will address UDC-degraded face recognition by focusing on pair matching by generating datasets that better reflect actual UDC artifacts (88.4). Jewon Yoo et al. (Samsung Display) will review existing UDC datasets and restoration methods and highlight the progress and challenges in this field (88.3).

Xiaohe Zhang et al. (BOE Display Technology) will cover a method to improve the stability and accuracy of a-Si LCDs with ambient light sensors (14.1). Rainer Minixhofer and Curd Trattler (ams-OSRAM AG) will discuss opportunities to implement true color and ambient light sensors using micro-photodetectors in-plane with microLED emitters to overcome limitations in state-of-the-art OLED displays (51.1). And Chris Bower et al. (X Display Company) will present measured attributes of a 140-ppi microLED display, including color gamut and power consumption (51.2).

In a poster of note, Huan-Chu Huang et al. (Visionox Technology) will introduce an a-Si copper etchant in which fluorine compounds are added to achieve a simultaneous etching effect of the metallic layer with Cu/MoTi and a non-metallic layer with a-Si (P.122).

Hot topics in this area include power reduction and consumption; privacy; LC technology as an optical component for AR/VR; improvements in brightness, color, speed, and manufacturing costs; and high- and low-temperature performance.

Yang Zeng et al. (Tianma Microelectronics) will demonstrate the feasibility of using a large cell gap LC cell as the optical anisotropic layer for the optical shift of display pixels, supporting up to 30-µm pixels when two cells are used in series. This method creates possibilities for enhancing display resolution with optical shift (78.4).

Kristiaan Neyts et al. (Hong Kong University of Science and Technology/Ghent University) will discuss how when chiral liquid crystal (CLC) layers are deposited on a substrate coated with a photoalignment layer, diffractive components can be realized (93.1).

Yongziyan Ma et al. (University of Central Florida) will propose a narrowband RGB structure that dramatically suppresses the chromatic aberration for a laser projector and QD LEDs (93.2).

Philip Bos et al. (Kent State University/Meta Reality Labs) will propose a single layer spatial light modulator (SLM) with phase and amplitude control for holographic displays (42.1).

Toshikazu Sumi et al. (FujiFilm Corporation) will discuss a new orientation control system that crystallizes the dye into fine crystals, achieving a coating-type polarizer with excellent optical properties with an order parameter of >0.97 (98.1).

Two notable posters include one by Yanni Liu et al. (BOE Optoelectronics Group), which will cover color shift improvement for IPS mode wide-view LCDs (P.178), and another by Zhao-Yi Chen et al. (Hong Kong University of Science and Technology) that will cover alignment layer optimization for electrically suppressed helix ferroelectric LCs (P.187).

Highlights in this area include topics such as the development of high-performance green phosphorescent-emitting materials for OLEDs, fluorescent blue OLED materials, hybrid tandem perovskite OLEDs, and groundbreaking material advancements for diverse color-gamut applications.

Jung Keun Kim et al. (LG Display) will discuss progress in white OLED (WOLED) technology for premium TV and IT displays and cover innovations for four-stack tandem WOLED (63.3).

Yontaek Hong et al. (Seoul National University) will cover the development of a direct electrode printing method onto a device using electrohydrodynamic printing (77.4).

Satomi Tasaki et al. (Idemitsu Kosan) will discuss a high-efficiency improvement for blue-fluorescent OLEDs through dual emitting layer technology that enhances performance by controlling the molecular orientation to boost efficiency (55.4).

Haonan Zhao et al. (University of Michigan, Ann Arbor) will introduce the polariton-enhanced Purcell (PEP) effect from both the anode and cathode contacts to achieve a 10× absolute device lifetime enhancement in tandem blue PEP-PHOLEDs (13.4).

One noted poster by Long Chen et al. (Tianma Microelectronics) will analyze the degradation of an organic charge-generation layer by impedance spectroscopy (P.201).

This year's Symposium will feature four special topics: Artificial Intelligence including Machine Learning for Imaging, Ultra-High Bandwidth Display Data Transmission and Processing, and new for 2025: Heterogeneous Integration on Glass and Other Substrates for Emerging Applications and Sustainable Displays and Green Technologies.

This special topic will feature five joint oral sessions, including two on display manufacturing and new sessions on automotive displays, emerging technologies, and active-matrix devices, reflecting the growing trend of AI adoption across the display industry.

The first session (91), jointly organized with the DMA and IDS subcommittees, will highlight the use of stable diffusion models to generate defect images for training detection models, with presentations from Xiaojun Tang et al. (BOE) (91.1) and Hong-Bin Lim et al. (Samsung Display) (91.2).

The second session (96) will explore advanced manufacturing techniques, with a presentation by Minkyu Yeo et al. (Samsung Display) that will emphasize generative AI and automated TFT pattern measurement (96.1). Bingqian Wang et al. (BOE Technology Group) will focus on large language models trained on display-related data (96.3).

The third session (72) is jointly organized with the AVH subcommittee. Chao-Ming Yu et al. (Industrial Technology Research Institute [ITRI]) will introduce integrating transparent displays, AR/VR technologies, and multimodal AI (72.1). Chien Yu Chen et al. (National Taiwan University of Science and Technology) will investigate the integration of computer-generated holography with advanced driver assistance systems for applications in AR HUDs (72.2).

The fourth session (22) is organized jointly with the ETAP subcommittee. Topics include thumb gesture recognition using wrist electromyography (EMG) signals by Yu Sheng Zeng et al. (National Taiwan University/Novatek Microelectronics) (22.2) and in-cell sensor-based color temperature prediction by Yi-Ting Chung et al. (Novatek Microelectronics) (22.4).

The fifth session (48) is a collaboration with the AMD subcommittee. Topics include AI-based analysis of the impact of TFT layouts on Mura defects by Kyongtae Park et al. (Samsung Display) (48.1) and using AI and TCAD simulations to improve high-mobility oxide TFT reliability by Hejing Sun (CSOT) (48.3).

New in 2025, this special topic naturally covers a broad scope. Spanning three sessions, this topic addresses developments in high-performance IC packaging for chiplet integration, packaging strategies for advanced displays, and mmWave radio frequency (RF) systems integration.

Satoru Kuramochi (Dai Nippon Printing Co.) will address the challenges of chiplet packaging by demonstrating a glass core substrate with a large panel size format, whereby substrate processing with three metalized processes is compared in terms of process capability, reliability, and high-speed transmission characteristics (81.3).

Venky Sundaram (3D System Scaling) will chart advanced packaging as a driver for future system scaling in bandwidth, power delivery, reliability, and cost, and will summarize the evolution of key building blocks at wafer and panel scales along with the outlook for glass packaging (81.4).

Sean Garner et al. (Corning Research and Development Center) will highlight engineered glass substrates optimized for material attributes, form factors, and innovative processing capabilities crucial for emerging high-performance display and non-display applications, enabling the heterogeneous assembly of electronic and opto-electronic devices (89.1).

Sheng Liu et al. (Wuhan University) will focus on design for X (DFX) as an engineering and design methodology presenting some successful applications of DFX in LEDs, including metal-organic chemical vapor deposition equipment manufacture, the heteroepitaxial growth of GaN-based epitaxial layers, LED packaging, and solid-state lighting products (89.4).

Kazuyuki Yamada (Japan Display Inc.) will address the challenges faced in advanced IC packaging, such as complex wiring or larger substrate size. The advanced IC substrate development takes advantage of flat-panel display manufacturing technology (94.4).

In late news, SB Cha (Visban Corporation) will describe the device architecture of high-frequency RF devices on glass and underlying processes required for systems integration, along with simulation and measurement data gauging the performance of glass-based network-controlled repeaters (94.5).

This special topic will explore sustainable display development, focusing on net-zero emissions and circular economy goals to address the environmental and social challenges of the global display industry's transformative growth.

A cluster of talks will feature the carbon footprint of display making, along with others on recycling in polarizers and solvents. Yusuke Kataoka et al. (AGC Inc. Innovative Technology Laboratories) will present an invited talk on lithium recycling by a top-3 glass manufacturer, where lithium mining and use is of worldwide, geopolitical importance (16.3). Burkhard Slischka et al. (ALLOS Semiconductors) will take a controversial look at how geopolitics enter our supply chains, going right at the elephant in the room (32.1). Similarly, they will look at the supply chains of some critical materials from the viewpoint of a Western employee of a Chinese company (32.3).

Presentations will investigate particular display films and how we can reuse, recycle, and reduce waste in their production and use. Pao-Ju Hsieh et al. (ITRI) will discuss a complete resource recycling ecosystem used to convert discarded polarizers into value-added upcycling applications (16.2). Tsung-Chou Hsu et al. (ITRI) will cover eco-friendly LCD panels through novel, easy-to-disassemble materials and nondestructive techniques (16.4). Hung-Che Lin (AUO) will propose an evaluation index of display sustainability (25.1), and Heekyun Shin et al. (Samsung Display) will discuss applying a DMPA cosolvent material that is NMP free to flexible OLED substrates, developing the first OLED panel using an eco-friendly polyimide substrate (25.2).

Finally, Hung-Che Lin et al. (AUO Corporation) will discuss developing a precise carbon footprint calculation that uses production data to identify effective reduction strategies (32.2). Hsin-Ying Chen et al. (AUO Corporation) will highlight the necessity of conducting thorough supply chain traceability investigations to ensure accuracy and reliability with carbon footprint assessments (32.4).

This special topic will explore cutting-edge technologies that are driving the evolution of display data transmission and processing (session 35) in emerging applications such as AR/VR/MR and high-resolution and frame-rate displays (session 39).

Junho Park et al. (Samsung Electronics) will introduce a novel eye margin test (EMT) feature that displays results in real time directly on the screen. The presentation will demonstrate how this approach significantly enhances the accuracy of eye diagram measurements, achieving 99 percent height accuracy through advanced RDAC calibration (35.1).

Qianqian Lv et al. (TCL CSOT) will tackle the challenge of Wi-Fi interference in display systems. Leveraging a CTLE circuit design, the researchers will propose methods to equalize low- and high-frequency signals, improving signal transmission quality, and ensuring stable display performance even in noisy environments (35.2).

Hongpeng Zhu et al. (TCL CSOT) will redefine the connector design for high-speed displays. By integrating ML models, such as XGBoost and Bayesian optimization, the authors will provide a predictive framework for key connector metrics, ensuring signal integrity in connectors supporting 25-Gbps bandwidth (35.3).

Hyun-Wook Lim et al. (Samsung Electronics) will discuss employing a multidrop high-speed link with foveated upscaling to reduce data transmission wires from 36 to 6 while optimizing sampling timing, which will assist in designing lightweight and efficient AR glasses (39.1).

Alex Henzen et al. (HYPHY USA) will present an approach to achieve 10× the video payload per wire-hertz compared to conventional methods, reducing costs and power requirements for UHD display drivers while maintaining exceptional image quality (39.2).

Hao Zhang et al. (BOE Technology Group) will propose a novel solution for VR rendering. By separating fixed backgrounds and changing foregrounds during rendering and employing gaze-based resolution techniques, the authors dramatically reduced system-on-chip bandwidth usage, ensuring seamless VR experiences even during rapid head movements (39.3).

Visit www.displayweek.org to find a full listing of the program offerings.