Toward characterization and assessment of MoS2 fundamental device properties by photoluminescence

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-03-25 DOI:10.1016/j.mssp.2025.109489
Thomas Nuytten, Albert Minj, Stefanie Sergeant, Quentin Smets, Steven Brems, Pawan Kumar, Souvik Ghosh, Tom Schram, Sreetama Banerjee, Anastasiia Kruv, Dennis van Dorp, Benjamin Groven, Pierre Morin
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Abstract

The continuous expansion of two-dimensional materials research since the first developments of over 15 years ago has enabled tremendous progress in the fundamental understanding of their properties and behavior. The promises held by these materials to facilitate scaling beyond silicon-based device architectures are still valid, but the manufacturability and integration with silicon technology remain challenging. On the metrology side, characterization of the device channel and assessment of the expected performance is lacking, at least in a fully non-destructive and process line-compatible implementation. The current paper demonstrates a clear correlation between metrics associated with the transistor performance on one hand, and parameters from photoluminescence spectra on the other. The concept is demonstrated on state-of-the-art 300 mm process MoS2 devices, without the need for specific measurement conditions or sample preparation. Being truly non-contact and relatively fast, this analysis provides the community with a potential route toward non-invasive material quality assessment, applicable at several stages of the process and with a direct connection to device performance.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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