Haidong Wu, Gang Dong, Wei Xiong, Chang Zhi, Shen Li, Zhangming Zhu, Yintang Yang
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引用次数: 2
Abstract
This letter presents an accurate magnetic coupling coefficient ($k$ ) model for a through-silicon via (TSV)-based 3-D transformer. The $k$ factor can be precisely derived from the self-inductance and mutual inductance, which are calculated by various analytical formulas based on physical geometries. The results of this model correspond well with those of Q3D extractor and high-frequency structural simulator (HFSS), with maximum errors of 3.8% and 4.4%, respectively. An equivalent circuit model of a TSV-based transformer is used for further verification. The S-parameters obtained by the circuit model match well with the measurements.
期刊介绍:
The IEEE Microwave and Wireless Components Letters (MWCL) publishes four-page papers (3 pages of text + up to 1 page of references) that focus on microwave theory, techniques and applications as they relate to components, devices, circuits, biological effects, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, medical and industrial activities. Microwave theory and techniques relates to electromagnetic waves in the frequency range of a few MHz and a THz; other spectral regions and wave types are included within the scope of the MWCL whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.