F. Sun, Zhenya Pan, Yang Liu, Xiang Li, Haoyu Liu, Wenpeng Li
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引用次数: 0
Abstract
Purpose
The purpose of this paper is to quickly manufacture full Cu3Sn-microporous copper composite joints for high-temperature power electronics applications and study the microstructure evolution and the shear strength of Cu3Sn at different bonding times.
Design/methodology/approach
In this paper, a novel structure of Cu/composite solder sheet/Cu was designed. The composite solder sheet was made of microporous copper filled with Sn. The composite joint was bonded by thermo-compression bonding under pressure of 0.6 MPa at 300°C. The microstructure evolution and the growth behavior of Cu3Sn at different bonding times were observed by electron microscope and metallographic microscope. The shear strength of the joint was measured by shear machine.
Findings
At initial bonding stage the copper atoms in the substrate and the copper atoms in the microporous copper dissolved into the liquid Sn. Then the scallop-liked Cu6Sn5 phases formed at the interface of liquid Sn/microporous copper and liquid Sn/Cu substrates. During the liquid Sn changing to Cu6Sn5 phases, Cu3Sn phases formed and grew at the interface of Cu6Sn5/Cu substrates and Cu6Sn5/microporous copper. After that the Cu3Sn phases continued to grow and the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained. The growth rule of Cu3Sn was parabolic growth. The shear strength of the composite joints was about 155 MPa.
Originality/value
This paper presents a novel full Cu3Sn-microporous copper composite joint with high shear strength for high-temperature applications based on transient liquid phase bonding. The microstructure evolution and the growth behavior of Cu3Sn in the composite joints were studied. The shear strength and the fracture mechanism of the composite joints were studied.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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