Defect patterns study of pick-and-place machine using automated optical inspection data

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2021-08-04 DOI:10.1108/ssmt-03-2021-0007
Yuqiao Cen, Jingxi He, Daehan Won
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引用次数: 1

Abstract

Purpose This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning. Design/methodology/approach This study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result. Findings The experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods. Practical implications This study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production. Originality/value The findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.
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利用自动光学检测数据研究摘放机缺陷模式
目的本文旨在基于自动光学检测数据,研究不同根本原因的零部件拾取和放置(P&P)缺陷模式,并利用机器学习开发一个根本原因识别模型。设计/方法/方法本研究通过实验模拟P&P机器的误差,包括喷嘴尺寸和喷嘴拾取位置。检查了具有不同误差的元件放置质量。本研究使用各种机器学习方法,基于检测结果开发了根本原因识别模型。实验结果表明,在转移过程中,错误的喷嘴尺寸会增加元件放置偏移的平均值和标准偏差,以及元件掉落的概率。此外,喷嘴拾取位置可能会影响旋转的零部件放置偏移。这些缺陷的根本原因可以使用机器学习方法追溯。实际意义本研究为表面安装技术装配线的操作员提供了了解P&P机器错误症状的机会。所开发的模型可以在实际生产中自动追溯缺陷的根源。独创性/价值这些发现有望将定期预防性维护转变为数据驱动的预测性和反应性维护。
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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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