Yang Gao, Fuwei Wang, Ding Shaohu, Bin Yang, Lin Liu, M. Salmani
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引用次数: 1
Abstract
Purpose
This study aims to investigate the vibration effects on ball grid array lifetime.
Design/methodology/approach
Several finite element method simulations and experiments were performed.
Findings
An optimized circuit configuration was found.
Originality/value
The originality of paper is confirmed by authors.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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