Leonid Anatolevich Olenev, R. Zakieva, N. Smirnova, R. Shichiyakh, K. Ershov, Nisith Geetha
{"title":"Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies","authors":"Leonid Anatolevich Olenev, R. Zakieva, N. Smirnova, R. Shichiyakh, K. Ershov, Nisith Geetha","doi":"10.1108/SSMT-12-2020-0055","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis study aims to present a more accurate lifetime prediction model considering solder chemical composition.\n\n\nDesign/methodology/approach\nThermal cycling and standard creep tests as well as finite element simulation were used.\n\n\nFindings\nThe study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.\n\n\nOriginality/value\nIt is confirmed.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2021-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/SSMT-12-2020-0055","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1
Abstract
Purpose
This study aims to present a more accurate lifetime prediction model considering solder chemical composition.
Design/methodology/approach
Thermal cycling and standard creep tests as well as finite element simulation were used.
Findings
The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.
Originality/value
It is confirmed.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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