W. Siswanto, K. Borodin, Z. Mahmoud, A. Surendar, S. Sajjadifar, G. Abdilova, Jun Chang
{"title":"Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems","authors":"W. Siswanto, K. Borodin, Z. Mahmoud, A. Surendar, S. Sajjadifar, G. Abdilova, Jun Chang","doi":"10.1108/SSMT-07-2020-0029","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThe purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.\n\n\nDesign/methodology/approach\nSeveral accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.\n\n\nFindings\nIt was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.\n\n\nOriginality value\nIt is confirmed.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2021-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/SSMT-07-2020-0029","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 4
Abstract
Purpose
The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model.
Design/methodology/approach
Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed.
Findings
It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration.
Originality value
It is confirmed.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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