Buen Zhang, N. Jabarullah, A. Alkaim, S. Danshina, I. Krasnopevtseva, Yuan Zheng, N. Geetha
{"title":"Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling","authors":"Buen Zhang, N. Jabarullah, A. Alkaim, S. Danshina, I. Krasnopevtseva, Yuan Zheng, N. Geetha","doi":"10.1108/ssmt-06-2020-0028","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis paper aims to establish a more accurate model for lifetime estimation.\n\n\nDesign/methodology/approach\nFinite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.\n\n\nFindings\nA more precise model was found.\n\n\nOriginality/value\nIt is confirmed that the paper is original.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2020-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1108/ssmt-06-2020-0028","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-06-2020-0028","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 8
Abstract
Purpose
This paper aims to establish a more accurate model for lifetime estimation.
Design/methodology/approach
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
Findings
A more precise model was found.
Originality/value
It is confirmed that the paper is original.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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