Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging

Abstract

Purpose – This paper aims to present an integrated optimisation‐modelling computational approach for virtual prototyping that helps design engineers to improve the reliability and performance of electronic components and systems through design optimisation at the early product development stage. The design methodology is used to identify the optimal design of lead‐free (Sn3.9Ag0.6Cu) solder joints in fine‐pitch copper column bumped flip‐chip electronic packages.Design/methodology/approach – The design methodology is generic and comprises numerical techniques for computational modelling (finite element analysis) coupled with numerical methods for statistical analysis and optimisation. In this study, the integrated optimisation‐modelling design strategy is adopted to prototype virtually a fine‐pitch flip‐chip package at the solder interconnect level, so that the thermal fatigue reliability of the lead‐free solder joints is improved and important design rules to minimise the creep in the solder material, exp...