Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245232

Yanan Yang, Yi Li, Jun Yang, Luqiao Yin, Longlong Chen, Jianhua Zhang

{"title":"Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding","authors":"Yanan Yang, Yi Li, Jun Yang, Luqiao Yin, Longlong Chen, Jianhua Zhang","doi":"10.1109/ICEPT47577.2019.245232","DOIUrl":null,"url":null,"abstract":"Laser-assisted glass frit bonding as a noncontact thermal bonding method has been widely applied in the organic light-emitting diodes (OLEDs) encapsulation field. However, blue light emitting from the OLEDs devices could cause many hazards. Therefore, it is of significance to develop a high reliable packaging technology with blue light-shielding performance for OLEDs. In this work, a BiVO4 thin film capable of shielding blue radiation applied in glass frit laser encapsulation were developed. BiVO4 thin films were deposited on glass by chemical solution deposition process. The effect of annealing temperature ranging from 573 to 873K on blue light-blocking performance has been investigated. The optimized BiVO4 films exhibited the best blue light-shielding capability and could block 50.32 % short wavelength blue light (400 - 450 nm), while maintaining greater than 87 % average transmittance in the wavelength range of 500 - 800 nm. Finally, the laser-assisted glass frit bonding device combined with optimized BiVO4 blue light-shielding film has been fabricated. Therefore, transparent BiVO4 film with high blue light-shielding efficiency are desirable for practical encapsulation applications.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"26 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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Abstract

Laser-assisted glass frit bonding as a noncontact thermal bonding method has been widely applied in the organic light-emitting diodes (OLEDs) encapsulation field. However, blue light emitting from the OLEDs devices could cause many hazards. Therefore, it is of significance to develop a high reliable packaging technology with blue light-shielding performance for OLEDs. In this work, a BiVO4 thin film capable of shielding blue radiation applied in glass frit laser encapsulation were developed. BiVO4 thin films were deposited on glass by chemical solution deposition process. The effect of annealing temperature ranging from 573 to 873K on blue light-blocking performance has been investigated. The optimized BiVO4 films exhibited the best blue light-shielding capability and could block 50.32 % short wavelength blue light (400 - 450 nm), while maintaining greater than 87 % average transmittance in the wavelength range of 500 - 800 nm. Finally, the laser-assisted glass frit bonding device combined with optimized BiVO4 blue light-shielding film has been fabricated. Therefore, transparent BiVO4 film with high blue light-shielding efficiency are desirable for practical encapsulation applications.

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激光辅助玻璃熔块结合蓝光屏蔽

激光辅助玻璃熔块键合作为一种非接触式热键合方法，在有机发光二极管封装领域得到了广泛的应用。然而，从oled设备发出的蓝光可能会造成许多危害。因此，开发具有屏蔽蓝光性能的高可靠性oled封装技术具有重要意义。本文研制了一种能够屏蔽蓝光辐射的BiVO4薄膜，用于玻璃熔块激光封装。采用化学溶液沉积法在玻璃表面沉积BiVO4薄膜。研究了573 ~ 873K的退火温度对材料蓝光阻隔性能的影响。优化后的BiVO4薄膜具有最佳的蓝光屏蔽能力，可阻挡50.32%的短波长蓝光(400 ~ 450 nm)，同时在500 ~ 800 nm波长范围内保持大于87%的平均透过率。最后，结合优化后的BiVO4蓝光屏蔽膜，制作了激光辅助玻璃熔块粘接装置。因此，具有高蓝光屏蔽效率的透明BiVO4薄膜是实际封装应用的理想选择。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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