Dynamic resistance monitoring of aging process of pressureless sintered nano-silver joints

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245831

Jingxuan Ma, Jiayun Feng, Yanhong Tian, D. Xu, M. Mayer

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Abstract

Nano-Ag paste is a promising lead-free chip bonding material used in the field of electronic packaging because of its low sintering temperature and high service temperature. The long-term reliability of pressure-assisted sintered nano-Ag joints has been extensively studied, but the knowledge on the performance of pressureless nano-Ag joints during long-term stressing is limited. In this paper, we studied the changes of the porosity, particle size and diffusion layer during the 9 day aging process at 150 °C. At the same time, the dynamic resistance monitoring system was used to monitor the resistance change of the solder joint in real time, and the resistance change curve during aging was drawn. During heating from room temperature to 150 °C the resistance increased. During thermal aging, the resistance value dropped by ≈25 % and finally stabilized after 4 to 5 days. By microscopic morphology analysis of the solder joints aged for different times, we found that porosity reduction was the reason for the resistance drop.

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无压烧结纳米银接头老化过程的动态电阻监测

纳米银浆具有烧结温度低、使用温度高的优点，是一种很有前途的无铅芯片粘接材料。压力辅助烧结纳米银接头的长期可靠性已经得到了广泛的研究，但对无压力烧结纳米银接头在长期应力作用下的性能了解有限。本文研究了在150℃下时效9 d过程中孔隙率、粒径和扩散层的变化。同时，利用动态电阻监测系统实时监测焊点的电阻变化，绘制出焊点老化过程中的电阻变化曲线。在从室温加热到150℃的过程中，电阻增加。热老化过程中，电阻值下降约25%，4 ~ 5天后趋于稳定。通过对不同时效时间焊点的微观形貌分析，发现气孔减少是导致电阻下降的原因。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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