A scalable substrate noise coupling model for mixed-signal ICs

A. Samavedam, K. Mayaram, T. Fiez
{"title":"A scalable substrate noise coupling model for mixed-signal ICs","authors":"A. Samavedam, K. Mayaram, T. Fiez","doi":"10.1109/ICCAD.1999.810636","DOIUrl":null,"url":null,"abstract":"A scalable macromodel for substrate noise coupling in heavily doped substrates has been developed. This model is simple since it requires only four parameters which can readily be extracted from a small number of device simulations or measurements. Once these parameters have been determined the model can be used for any spacing between the injection and sensing contacts and for different contact geometries. The scalability of the model with separation and width provides insight into substrate coupling and optimization issues prior to and during the layout phase. The model is validated for a 2 /spl mu/m and a 0.5 /spl mu/m CMOS process where it is shown that the simple model predicts the noise coupling accurately. Measurements from a chip fabricated in a 0.5 /spl mu/m CMOS process show good agreement with the model.","PeriodicalId":6414,"journal":{"name":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1999-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1999.810636","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10

Abstract

A scalable macromodel for substrate noise coupling in heavily doped substrates has been developed. This model is simple since it requires only four parameters which can readily be extracted from a small number of device simulations or measurements. Once these parameters have been determined the model can be used for any spacing between the injection and sensing contacts and for different contact geometries. The scalability of the model with separation and width provides insight into substrate coupling and optimization issues prior to and during the layout phase. The model is validated for a 2 /spl mu/m and a 0.5 /spl mu/m CMOS process where it is shown that the simple model predicts the noise coupling accurately. Measurements from a chip fabricated in a 0.5 /spl mu/m CMOS process show good agreement with the model.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
混合信号集成电路的可扩展衬底噪声耦合模型
建立了一个可扩展的高掺杂衬底噪声耦合宏观模型。该模型很简单,因为它只需要四个参数,这些参数可以很容易地从少量设备模拟或测量中提取出来。一旦确定了这些参数,该模型就可以用于注射和感应触点之间的任何间距以及不同的触点几何形状。该模型具有分离和宽度的可扩展性,可以在布局阶段之前和期间深入了解基板耦合和优化问题。在2 /spl mu/m和0.5 /spl mu/m的CMOS工艺中验证了该模型,结果表明该简单模型能够准确地预测噪声耦合。在0.5 /spl μ m CMOS工艺中制造的芯片的测量结果与模型吻合良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Least fixpoint approximations for reachability analysis Performance optimization using separator sets A scalable substrate noise coupling model for mixed-signal ICs JMTP: an architecture for exploiting concurrency in embedded Java applications with real-time considerations Electromagnetic parasitic extraction via a multipole method with hierarchical refinement
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1