Graphene fillers for ultra-efficient thermal interface materials

K. Shahil, V. Goyal, R. Gulotty, A. Balandin
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引用次数: 3

Abstract

Summary form only given. Continuous scaling of Si CMOS devices and circuits, increased speed and integration densities resulted in problems with thermal management of nanoscale device and computer chips. Further progress in information, communication and energy storage technologies requires more efficient heat removal methods and stimulates the search for thermal interface material (TIMs) with enhanced thermal conductivity. The commonly used TIMs are filled with the particles such as silver or silica. The conventional TIMs require high volume fractions of the filler (~70%) to achieve thermal conductivity of ~1-5 W/mK. Recently, some of us discovered that graphene has extremely high intrinsic thermal conductivity, which exceeds that of carbon nanotubes. To use this property for thermal management of nanoscale electronic devices, we utilized the inexpensive liquid-phase exfoliated graphene and multi-layer graphene (MLG) as filler materials in TIMs. The thermal properties of the obtained graphene-epoxy composites were measured using the “laser flash” technique. It was found that the thermal conductivity enhancement factor exceeded a factor of 23 at 10% of the graphene volume loading fraction. This enhancement is larger than anything that has been achieved using other fillers. We have also tested graphene flakes in the electrically-conductive hybrid graphene-metal particle TIMs. The thermal conductivity of resulting composites was increased by a factor of ~5 in a temperature range from 300 K to 400 K at a small graphene loading fraction of 5-vol.-%. The unusually strong enhancement of thermal properties was attributed to the high thermal conductivity of graphene, strong graphene coupling to matrix materials and the large range of the length-scale - from nanometers to micrometers - of the graphene and silver particle fillers. Graphene-based TIMs have a number of other advantages related to their viscosity and adhesion, which meet the industry requirements. Our results suggest that graphene can become excellent filler materials in the next generation of TIMs for the electronic, optoelectronic and photovoltaic solar cell applications.
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石墨烯填料用于超高效热界面材料
只提供摘要形式。硅CMOS器件和电路的不断缩小,速度和集成密度的增加导致纳米级器件和计算机芯片的热管理问题。信息、通信和储能技术的进一步发展需要更有效的散热方法,并刺激对具有增强导热性的热界面材料(TIMs)的研究。常用的TIMs填充了银或二氧化硅等颗粒。传统的TIMs需要高体积分数的填料(~70%)来实现~1-5 W/mK的导热系数。最近,我们中的一些人发现石墨烯具有极高的固有热导率,超过了碳纳米管。为了将这种特性用于纳米级电子器件的热管理,我们使用了廉价的液相剥离石墨烯和多层石墨烯(MLG)作为TIMs的填充材料。采用“激光闪光”技术对制备的石墨烯-环氧复合材料的热性能进行了测试。结果表明,当石墨烯体积负载分数为10%时,其导热系数增加了23倍以上。这种增强比使用其他填料所获得的任何增强都要大。我们还测试了导电石墨烯-金属混合颗粒TIMs中的石墨烯薄片。当石墨烯负载分数为5伏-%时,复合材料的导热性在300 ~ 400 K的温度范围内提高了约5倍。热性能的异常增强归因于石墨烯的高导热性,石墨烯与基质材料的强耦合以及石墨烯和银颗粒填料的大长度范围(从纳米到微米)。基于石墨烯的TIMs在粘度和附着力方面具有许多其他优势,符合行业要求。我们的研究结果表明,石墨烯可以成为电子、光电和光伏太阳能电池应用的下一代TIMs的优秀填充材料。
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