Research on BCB/Cu thin film multilayer interconnection technology based on LTCC substrate for Microsystem Integration

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245776

Jing Chen, Lei Ding, Weipeng Ren, Tao Chen, Lichun Wang, Tao Zhao

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引用次数: 1

Abstract

Considering the requirements of Microsystems miniaturization integration for high-performance film-forming substrates, the key technologies of multilayer BCB/Cu thin film interconnection based on LTCC substrates and the related process controls were studied. A high reliability "T" interface interconnection method for thin film magnetron sputtering Cr/Cu/Cr and Cr/Pd/Au composite membrane structure and its preparation method were proposed. The effects of the interface defect and roughness of LTCC-thin film, the control of residual photoresist quantity in BCB film through holes and the stress of metallization of dielectric membrane on the quality of thick thin film composite substrate were studied. The prepared 12-layer thick thin film mixed substrate(10 layers LTCC substrate, 2 layers of thin film wiring) 60 pieces, all passed the GJB2438 C. 2.7 film substrate evaluation standard. Compared to the LTCC substrate, the wiring density is increased by 4 times, size reduced by 40 %.

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微系统集成中基于LTCC衬底的BCB/Cu薄膜多层互连技术研究

考虑到高性能成膜衬底对微系统小型化集成化的要求，研究了基于LTCC衬底的多层BCB/Cu薄膜互连的关键技术及相关工艺控制。提出了一种高可靠性磁控溅射Cr/Cu/Cr和Cr/Pd/Au复合膜结构的“T”界面互连方法及其制备方法。研究了ltcc -薄膜的界面缺陷和粗糙度、BCB膜孔中残留光刻胶量的控制以及介质膜金属化应力对厚薄膜复合基板质量的影响。所制备的12层厚薄膜混合衬底(10层LTCC衬底，2层薄膜布线)60片，均通过gjb2438c . 2.7薄膜衬底评价标准。与LTCC基板相比，布线密度增加了4倍，尺寸减小了40%。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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