{"title":"Metallic ions drift in hybrid bonding integration modeling, towards the evolution of failure criterion","authors":"Manzanarez Hervé, Moreau Stéphane, Cueto Olga","doi":"10.1109/SISPAD.2019.8870476","DOIUrl":null,"url":null,"abstract":"Copper ions drift is modeled in the case of hybrid bonding integration. The continuity equation is coupled to the Poisson’s equation and a copper ion concentration saturation is assumed. A 1D geometry simulation is initially realized to validate the model and 2D geometry simulations of hybrid bonding are analyzed by looking the time to percolate (TTP).","PeriodicalId":6755,"journal":{"name":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"96 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2019.8870476","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Copper ions drift is modeled in the case of hybrid bonding integration. The continuity equation is coupled to the Poisson’s equation and a copper ion concentration saturation is assumed. A 1D geometry simulation is initially realized to validate the model and 2D geometry simulations of hybrid bonding are analyzed by looking the time to percolate (TTP).
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
