Impact of HZO and HSO thin film ferroelectric on FDSOI NCFET

R. Shaik, K. P. Pradhan
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引用次数: 4

Abstract

In this work, negative capacitance effect of MFMIS type FDSOI NCFET is investigated considering two well known thin film ferroelectric materials HZO (Zirconium doped HfO2) and HSO (Silicon doped HfO2). The investigations are carried out in a TCAD environment where the gate charge is extracted from the TCAD simulation and subsequently computed ferro voltage across the ferroelectric capacitor to find the effective gate voltage in the gate-stack. The obtained values are then subjected to variation in ferroelectric thickness to predict the onset of hysteresis for both HZO and HSO ferroelectric materials. It has been observed that the HZO ferroelectric offers superior improvement in sub-threshold slope (SS), peak-gm and off-current at lower ferroelectric thickness with the expense of gate-induced-drain-leakage (GIDL) and lower endurance to hysteresis. On the other hand, the HSO ferroelectric predicts improvement in SS, peak-gm and off-current with superior control in GIDL where the device has higher endurance towards hysteresis in-spite of ferroelectric thickness under sub-10 nm regime.
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HZO和HSO薄膜铁电对FDSOI nfet的影响
本文考虑了两种著名的薄膜铁电材料HZO(锆掺杂HfO2)和HSO(硅掺杂HfO2),研究了MFMIS型FDSOI NCFET的负电容效应。研究是在TCAD环境中进行的,从TCAD模拟中提取栅极电荷,随后计算铁电电容器上的铁电压,以找到栅极堆中的有效栅极电压。得到的数值随后受到铁电厚度变化的影响,以预测HZO和HSO铁电材料的迟滞开始。在较低铁电厚度下,HZO铁电在亚阈值斜率(SS)、峰值gm和关断电流方面有较好的改善,但代价是栅极漏极(GIDL)的损耗和较低的滞回耐久性。另一方面,HSO铁电预示着在GIDL中SS、峰值gm和关流的改善,在GIDL中,尽管在低于10 nm的情况下铁电厚度,器件仍具有更高的滞回耐力。
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