M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde
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引用次数: 2
Abstract
In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.
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