J. Navrátil, Tomas Rericha, Vaclav Smitka, A. Hamácek
{"title":"Double Sided Printed Pattern Interconnected by Aerosol Jet and NCA Technologies","authors":"J. Navrátil, Tomas Rericha, Vaclav Smitka, A. Hamácek","doi":"10.1109/ISSE.2019.8810265","DOIUrl":null,"url":null,"abstract":"This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton and glass substrate, Aerosol Jet nanoparticle silver ink and UV curable NCA were used. The aim of the research is to create a reliable interconnection for double sided printed electronics attached to rigid substrate while using printing technologies and adhesives. The printing technology is used for printing on 3D structure and also for printing micro 3D structures due to lowering the contact resistance of NCA attached side.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"4 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents interconnecting of printed electronics patterns by printing technologies or non-conductive adhesives (NCA). DuPont Kapton and glass substrate, Aerosol Jet nanoparticle silver ink and UV curable NCA were used. The aim of the research is to create a reliable interconnection for double sided printed electronics attached to rigid substrate while using printing technologies and adhesives. The printing technology is used for printing on 3D structure and also for printing micro 3D structures due to lowering the contact resistance of NCA attached side.
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