S. Mukundan, M. Pagey, C. Cirba, peixiong zhao, K. Galloway
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引用次数: 0
Abstract
We present a TCAD-based approach for characterizing hot-carrier degradation in p-channel MOSFETs that includes models for hot-electron injection, carrier transport, and electron trapping in the oxide. The energy-balance equations have been solved in the silicon substrate to accurately model the carrier-heating and injection processes. This approach clearly illustrates the physical mechanisms responsible for hot-carrier degradation in p-channel MOSFETs. The simulations have been compared with experimental data obtained from 0.8μm SOI pMOS devices and show an excellent match.
我们提出了一种基于tcad的方法来表征p沟道mosfet中的热载子降解,包括热电子注入,载流子输运和氧化物中的电子捕获模型。在硅衬底上求解了能量平衡方程,以精确模拟载流子加热和注入过程。这种方法清楚地说明了p沟道mosfet中热载流子退化的物理机制。仿真结果与0.8μm SOI pMOS器件的实验数据吻合良好。