Preparation of micro fluidic chip based on SU-8 mold

Yuanqing Wu, Su-Ying Yao
{"title":"Preparation of micro fluidic chip based on SU-8 mold","authors":"Yuanqing Wu, Su-Ying Yao","doi":"10.1109/EDSSC.2011.6117676","DOIUrl":null,"url":null,"abstract":"As the silicon mold has rough edges, microchip is not conducive to fluid movement. In this paper, mold was produced by SU-8, and a set of production process was given. Then this paper made anti-stick layer on the mold, in order to improve mold re-use rate. Author discussed the impact of curing temperature and the ratio of PDMS and curing agent on the device, and does modification on casting PDMS, then seal to complete the microarray.","PeriodicalId":6363,"journal":{"name":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","volume":"27 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2011.6117676","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

As the silicon mold has rough edges, microchip is not conducive to fluid movement. In this paper, mold was produced by SU-8, and a set of production process was given. Then this paper made anti-stick layer on the mold, in order to improve mold re-use rate. Author discussed the impact of curing temperature and the ratio of PDMS and curing agent on the device, and does modification on casting PDMS, then seal to complete the microarray.
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基于SU-8模具的微流控芯片的制备
由于硅模边缘粗糙,微芯片不利于流体运动。本文利用SU-8进行了模具的生产,并给出了一套生产工艺。然后在模具上制作防粘层,以提高模具的重复利用率。讨论了固化温度和PDMS与固化剂配比对器件的影响,并对铸造PDMS进行了改性,然后密封完成芯片。
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