Thermal Analysis of Sealed Electromagnetic Relays Using 3-D Finite Element Method

Huimin Liang, Wenlong Wang, G. Zhai
{"title":"Thermal Analysis of Sealed Electromagnetic Relays Using 3-D Finite Element Method","authors":"Huimin Liang, Wenlong Wang, G. Zhai","doi":"10.1109/HOLM.2007.4318227","DOIUrl":null,"url":null,"abstract":"Up to now, it is difficult to test the inner temperatures of sealed electromagnetic relays. In this paper, the temperature distribution of a sealed electromagnetic relay is obtained by using 3-D finite element analysis. The quality of thermal simulation results depends on the accuracy of both the modeled heat sources and heat sinks. Due to the high performance requirements of sealed electromagnetic relay it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components. Therefore, the non-metallic parts of the sealed electromagnetic relay (including the air within the device) are now part of the model. In order to improve the accuracy of simulation, the contact radius is calculated in advance. The relationship between convection heat transfer coefficient and temperature and how to consider connecting wires boundary condition are also researched here. Finally, the temperature distribution of a sealed electromagnetic relay is obtained by this method. Comparisons with experimental results confirm its validity.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.2007.4318227","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

Up to now, it is difficult to test the inner temperatures of sealed electromagnetic relays. In this paper, the temperature distribution of a sealed electromagnetic relay is obtained by using 3-D finite element analysis. The quality of thermal simulation results depends on the accuracy of both the modeled heat sources and heat sinks. Due to the high performance requirements of sealed electromagnetic relay it is interesting to know not only the temperatures of the conducting parts but also the thermal impact on the plastic components. Therefore, the non-metallic parts of the sealed electromagnetic relay (including the air within the device) are now part of the model. In order to improve the accuracy of simulation, the contact radius is calculated in advance. The relationship between convection heat transfer coefficient and temperature and how to consider connecting wires boundary condition are also researched here. Finally, the temperature distribution of a sealed electromagnetic relay is obtained by this method. Comparisons with experimental results confirm its validity.
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密封电磁继电器的三维有限元热分析
到目前为止,对密封电磁继电器内部温度的测试是比较困难的。本文采用三维有限元分析方法,得到了密封电磁继电器的温度分布。热模拟结果的质量取决于模拟热源和散热器的精度。由于密封电磁继电器的高性能要求,不仅要知道导电部件的温度,还要知道对塑料部件的热影响。因此,密封电磁继电器的非金属部分(包括装置内的空气)现在是模型的一部分。为了提高仿真精度,对接触半径进行了提前计算。研究了对流换热系数与温度的关系以及如何考虑接线边界条件。最后,用该方法得到了密封电磁继电器的温度分布。与实验结果的比较验证了该方法的有效性。
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