A 3×40Gb/s 28nm FDSOI CMOS front-end array with 10mVPP sensitivity and >4VPP output swing

S. Shopov, S. Voinigescu
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引用次数: 2

Abstract

A versatile three-lane transceiver front-end is integrated in a production 28nm FDSOI CMOS technology. Each lane can operate at up to 40Gb/s data rate in receive mode with record 10mVPP sensitivity and 40dB gain, or up to 60Gb/s data rate in transmit mode with adjustable output swing between 2.6 and 4.3 VPP in a 50Ω load, as needed for a variety of silicon photonics and III-V optical modulators. The output stage can swing up to 100 mA at 60 Gb/s in 50Ω or 100fF capacitive loads. Single-ended CMOS inverter-based topologies are employed in all circuit blocks to minimize power consumption and to reduce the lane footprint to that of a ground-signal pad I/O. Even with the reduced footprint, special layout techniques enabled a lane-to-lane isolation better than 40 dB up to 55 GHz. The measured Tx-to-Rx dynamic range is larger than 54 dB at 40 Gb/s.
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一个3×40Gb/s 28nm FDSOI CMOS前端阵列,灵敏度10mVPP,输出摆幅>4VPP
多功能三通道收发器前端集成在生产28nm FDSOI CMOS技术中。每个通道可以在接收模式下以高达40Gb/s的数据速率工作,具有创纪录的10mVPP灵敏度和40dB增益,或在发送模式下以高达60Gb/s的数据速率工作,在50Ω负载下可在2.6和4.3 VPP之间调节输出摆幅,根据需要用于各种硅光子学和III-V光学调制器。输出级可以在50Ω或100fF电容负载下以60gb /s的速度振荡高达100ma。在所有电路块中都采用基于单端CMOS逆变器的拓扑结构,以最大限度地减少功耗,并将通道占用面积减少到与地面信号垫I/O相同。即使减少了占用空间,特殊的布局技术也使通道对通道的隔离性能优于40db,最高可达55ghz。在40 Gb/s时,测量到的txto - rx动态范围大于54 dB。
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