Thermal Modelling and Simulation Techniques for Multicore Processors

Abstract

Power dissipation for processors used in portable devices evolved along the evolution of processor capabilities, translated also into a significant amount of heat that must be removed from the cores. The current research aims to correctly model and simulate the processor assembly, as a whole, and to be able to approximate the temperature levels on the processor chip for an accurate thermal design. The simulation scenarios developed for this study include analyzing the temperature levels on the processor in case a high load task runs on one of the cores, for two multicore processing units. The results can be successfully integrated into the very early stages of thermal design for portable devices.