Effect of electrical current on the morphology and kinetics of formation of intermetallic phases in bimetallic aluminum-copper joints

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI:10.1109/HOLM.1993.489685

M. Braunovic, N. Aleksandrov

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引用次数: 27

Abstract

The effect of electrical current on the morphology and kinetics of formation of intermetallic compounds of bimetallic friction welded aluminum-copper joints was studied. The formation and growth of intermetallic compounds was studied in the temperature ranges 200-500/spl deg/C that was realized by heating Al-Cu joints with an AC current of different intensities (400-1000 A). The presence of an electrical field greatly accelerates the kinetics of formation of intermetallic phases and alters significantly their morphology. The formation and growth of intermetallic phases exerts a pronounced effect on the mechanical (microhardness) and electrical integrity of aluminum-copper joints. The contact resistance increases linearly with the thickness of the intermetallics. The phases formed are very hard and extremely brittle. The growth kinetics of intermetallic phases under the influence of electrical current is much higher than that under diffusion annealing in furnace.

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电流对双金属铝铜接头中金属间相形态及形成动力学的影响

研究了电流对双金属摩擦焊铝铜接头金属间化合物形貌和形成动力学的影响。用不同强度的交流电流(400-1000 A)加热Al-Cu接头，在200-500/spl℃范围内研究了金属间化合物的形成和生长。电场的存在大大加速了金属间相的形成动力学，并显著改变了金属间相的形态。金属间相的形成和生长对铝铜接头的力学(显微硬度)和电完整性有显著影响。接触电阻随金属间化合物厚度线性增加。形成的相非常硬，而且非常脆。在电流作用下，金属间相的生长动力学远高于在炉内扩散退火的生长动力学。

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Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts

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