{"title":"Reliability evaluation of buck converter based on\nthermal analysis","authors":"M. Mojibi, M. Radmehr","doi":"10.33180/infmidem2018.404","DOIUrl":null,"url":null,"abstract":"The design, which is based on the concept of reliability, is impressive. In power electronic circuits, the reliability design has\nbeen shown to be useful over time. Moreover, power loss in switches and diodes plays a permanent role in reliability assessment. This\npaper presents a reliability evaluation for a buck converter based on thermal analysis of an insulated-gate bipolar transistor (IGBT) and\na diode. The provided thermal analysis is used to determine the switch and diode junction temperature. In this study, the effects of\nswitching frequency and duty cycle are considered as criteria for reliability. A limit of 150°C has been set for over-temperature issues.\nThe simulation of a 12 kW buck converter (duty cycle = 42% and switching frequency = 10 kHz) illustrates that the switch and diode\njunction temperature are 117.29°C and 122.27°C, respectively. The results show that mean time to failure for the buck converter is\n32,973 hours.","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"41 1","pages":""},"PeriodicalIF":0.6000,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.33180/infmidem2018.404","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1
Abstract
The design, which is based on the concept of reliability, is impressive. In power electronic circuits, the reliability design has
been shown to be useful over time. Moreover, power loss in switches and diodes plays a permanent role in reliability assessment. This
paper presents a reliability evaluation for a buck converter based on thermal analysis of an insulated-gate bipolar transistor (IGBT) and
a diode. The provided thermal analysis is used to determine the switch and diode junction temperature. In this study, the effects of
switching frequency and duty cycle are considered as criteria for reliability. A limit of 150°C has been set for over-temperature issues.
The simulation of a 12 kW buck converter (duty cycle = 42% and switching frequency = 10 kHz) illustrates that the switch and diode
junction temperature are 117.29°C and 122.27°C, respectively. The results show that mean time to failure for the buck converter is
32,973 hours.
期刊介绍：
Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material.
Topics of interest include:
Microelectronics,
Semiconductor devices,
Nanotechnology,
Electronic circuits and devices,
Electronic sensors and actuators,
Microelectromechanical systems (MEMS),
Medical electronics,
Bioelectronics,
Power electronics,
Embedded system electronics,
System control electronics,
Signal processing,
Microwave and millimetre-wave techniques,
Wireless and optical communications,
Antenna technology,
Optoelectronics,
Photovoltaics,
Ceramic materials for electronic devices,
Thick and thin film materials for electronic devices.
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