Effect of Cu insertion layer between top electrode and switching layer on resistive switching characteristics

Sunghun Jung, Jeong-Hoon Oh, K. Ryoo, Sungjun Kim, Jong-Ho Lee, Hyungcheol Shin, Byung-Gook Park
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Abstract

By inserting copper (Cu) metal layer between platinum (Pt) and titanium dioxide (TiO2), we have observed both unipolar and bipolar resistive switching characteristics in Pt/Cu/TiO2/Pt stacked RRAM cell. In order to analyze the conduction mechanism, we have conducted I-V fitting. And based on measurement results of bias polarity dependency, we have found that copper plays a role as oxygen reservoir. It can explain redox mechanism in bipolar resistive switching cell.
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顶电极与开关层之间的铜插入层对电阻开关特性的影响
通过在铂(Pt)和二氧化钛(TiO2)之间插入铜(Cu)金属层,我们观察到了Pt/Cu/TiO2/Pt堆叠RRAM电池的单极和双极电阻开关特性。为了分析传导机理,我们进行了I-V拟合。根据偏置极性依赖性的测量结果,我们发现铜具有储氧的作用。可以解释双极电阻开关电池的氧化还原机理。
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