MEMS reliability in shock environments

Abstract

In order to determine the susceptibility of our MEMS (MicroElectroMechanical Systems) devices to shock, tests were performed using haversine shock pulses with widths of 1 to 0.2 ms in the range from 500 g to 40000 g. We chose a surface-micromachined microengine because it has all the components needed for evaluation: springs that flex, gears that are anchored, and clamps and spring stops to maintain alignment. The microengines, which were unpowered for the tests, performed quite well at most shock levels with a majority functioning after the impact. Debris from the die edges moved at levels greater than 4000 g causing shorts in the actuators and posing reliability concerns. The coupling agent used to prevent stiction in the MEMS release weakened the die-attach bond, which produced failures at 10000 g and above. At 20000 g we began to observe structural damage in some of the thin flexures and 2.5-micron diameter pin joints. We observed electrical failures caused by the movement of debris. Additionally, we observed a new failure mode where stationary comb fingers contact the ground plane resulting in electrical shorts. These new failures were observed in our control group indicating that they were not shock related.