{"title":"The reliability approaches and requirements for IC component in telecom system","authors":"Guofujun, Zhoujiang, Xieronghua","doi":"10.1109/IRPS.2012.6241834","DOIUrl":null,"url":null,"abstract":"Telecom system and its reliability are introduced. Approaches in telecom equipment design and manufacture are summarized, such as IC supplier process management, incoming quality control, failure rate and wear-out lifetime evaluation, equipment process online monitor, reliability burn-in and screening, field failure analysis and improvement and so on. Telecom equipment becomes more complicated and integrated and brings engineering challenges to board design with IC component suffering high electrical, temperature and mechanical stress. Flexible and low cost engineering approaches introduced and requirements for IC industry proposed.","PeriodicalId":6387,"journal":{"name":"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)","volume":"54 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2012-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.2012.6241834","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Telecom system and its reliability are introduced. Approaches in telecom equipment design and manufacture are summarized, such as IC supplier process management, incoming quality control, failure rate and wear-out lifetime evaluation, equipment process online monitor, reliability burn-in and screening, field failure analysis and improvement and so on. Telecom equipment becomes more complicated and integrated and brings engineering challenges to board design with IC component suffering high electrical, temperature and mechanical stress. Flexible and low cost engineering approaches introduced and requirements for IC industry proposed.
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