Phosphor particle spatial patterning for high angular color uniformity LED packaging through selective curing and settling

Xinyao Lu, Weixiang Wang, Zhenpeng Su, Sheng Liu, Huai Zheng
{"title":"Phosphor particle spatial patterning for high angular color uniformity LED packaging through selective curing and settling","authors":"Xinyao Lu, Weixiang Wang, Zhenpeng Su, Sheng Liu, Huai Zheng","doi":"10.1109/ICEPT47577.2019.245234","DOIUrl":null,"url":null,"abstract":"Uniform angular color distribution is regarded as a key index of high-quality light-emitting diode(LED) devices. The angular color uniformity is decided by the coated phosphor layer in the LED packaging. In this study, we demonstrated a method of manipulating phosphor particle spatial distributions for the high ACU LED packaging. In the presented method, the laser irradiation was used to selectively and rapidly cure the phosphor gel. The particles in the uncured phosphor gel settled on its bottom with the action of the gravity. By this method, we realized a phosphor layer configuration in which a conformal particle layer was deposited on the LED chip surfaces and the particles were randomly and uniformly distributed into the gel located above the LED chip. Compared to the dispensing phosphor coating and simple settling coating, such a phosphor particle spatial distribution significantly enhance the ACU, and the enhancement reaches more than 51%.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"167 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245234","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Uniform angular color distribution is regarded as a key index of high-quality light-emitting diode(LED) devices. The angular color uniformity is decided by the coated phosphor layer in the LED packaging. In this study, we demonstrated a method of manipulating phosphor particle spatial distributions for the high ACU LED packaging. In the presented method, the laser irradiation was used to selectively and rapidly cure the phosphor gel. The particles in the uncured phosphor gel settled on its bottom with the action of the gravity. By this method, we realized a phosphor layer configuration in which a conformal particle layer was deposited on the LED chip surfaces and the particles were randomly and uniformly distributed into the gel located above the LED chip. Compared to the dispensing phosphor coating and simple settling coating, such a phosphor particle spatial distribution significantly enhance the ACU, and the enhancement reaches more than 51%.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过选择性固化和沉淀实现高角度色彩均匀性LED封装的荧光粉粒子空间图形化
均匀的角度颜色分布被认为是高质量发光二极管(LED)器件的关键指标。LED封装中所包覆的荧光粉层决定了其角度色彩均匀性。在本研究中,我们展示了一种用于高ACU LED封装的操纵荧光粉粒子空间分布的方法。该方法采用激光辐照对荧光凝胶进行选择性快速固化。未固化的荧光粉凝胶中的颗粒在重力作用下沉降在其底部。通过这种方法,我们实现了一种荧光粉层的配置,在LED芯片表面沉积了一层共形粒子层,粒子随机均匀地分布在LED芯片上方的凝胶中。与点胶荧光粉涂层和简单沉淀涂层相比,这种荧光粉颗粒的空间分布显著增强了ACU,增强幅度达到51%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Laser-assisted Glass Frit Bonding Combined With Blue Light-shielding Dynamic resistance monitoring of aging process of pressureless sintered nano-silver joints Warpage simulation method development considering moiré inhomogeneous temperature field Size effects on segregated growth kinetics of interfacial IMC between Sn solder and Cu substrate Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1