T. Jeong, S. Windu, Dong-Cheon Baek, Jinseok Kim, Kyuho Tak, Miji Lee, Hyuniun Choi, S. Pae, Jongwoo Park
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引用次数: 0
Abstract
Early failure of the short-lead metal line EM (Electromigration) is investigated. Applying Wheatstone bridge (WSB) test structure and 3-parameter lognormal distribution enables to reduce sample size and time-to-fail (TTF) variation governed by early fails causing a poor standard deviation, EM lifetime is accurately predicted and improved by ~280×. In particular, EM TTF at lower percentiles can be well represented by 3-parameter lognormal. With respect to physical aspects of void, EM behaviors of the short-lead and long-lead metal line are addressed based on experimental results compared with Monte-Carlo simulations to support the Blech's back-stress effects.
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