Self-Assembly Study to Precisely Align Dies Having Microbump Covered with Non-Conductive Film for Advanced Chip-to-Wafer 3D Integration

Abstract

We demonstrated new self-assembly for high-throughput and high-yield multichip-to-wafer 3D stacking using chips covered with a non-conductive film (NCF) on the top surface. The NCF is a promising candidate to completely fill between small microbumps of the chips and is essential for realizing fine-pitch microbump-to-microbump interconnections. 3-mm-square chips laminated with the NCF were precisely self-assembled to wafers within 4 m by surface tension of water. The results indicate that the self-assembly technique using chips with the NCF can achieve not only high-accurate chip alignment but also high-strength chip bonding at once.