Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

Abstract

In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.